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公开(公告)号：US20180027649A1
公开(公告)日：2018-01-25
申请号：US15718507
申请日：2017-09-28
发明人： Yu-Tung Huang , Ming-Hung Chang , Szu-Heng Liu , You-Jen Cho
IPC分类号： H05K1/02 , G01N33/487 , G01N31/00 , H05K3/10 , G01N33/18
CPC分类号： H05K1/0272 , G01N31/00 , G01N33/18 , G01N33/48707 , H01L23/15 , H01L23/49811 , H01L23/49827 , H01L24/13 , H01L24/81 , H01L2224/1319 , H01L2224/16237 , H01L2224/81192 , H01L2224/81385 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H05K1/111 , H05K3/10 , H05K3/305 , H05K2201/0302 , H05K2201/0373 , H05K2201/09781 , Y02P70/613 , Y10T156/10 , H01L2924/00014
摘要： A strip for an electronic device senses a liquid sample. The strip includes a substrate having a first surface, a plurality of protrusions disposed on the first surface, and each having a width, and a hydrophilic layer having a layer surface disposed on the first surface and the plurality of protrusions, and having a second surface opposite to the layer surface, whereby the liquid sample and the second surface have a contact angle therebetween ranging from 2 to 85 degrees when the liquid sample is disposed on the hydrophilic layer.
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公开(公告)号：US20150189802A1
公开(公告)日：2015-07-02
申请号：US14588321
申请日：2014-12-31
发明人： Yu-Tung Huang , Ming-Hung Chang
CPC分类号： H05K3/305 , H01L23/49811 , H01L24/13 , H01L24/81 , H01L2224/1319 , H01L2224/16237 , H01L2224/81192 , H01L2224/81385 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H05K1/111 , H05K2201/0373 , H05K2201/09781 , Y02P70/613 , Y10T156/10 , H01L2924/00014
摘要： A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface.
摘要翻译： 导电封装结构包括基板和导电材料。 导电材料形成为第一图案化结构。 第一图案结构具有连接到基板的第一表面和与第一表面相对的图案化的第二表面。
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公开(公告)号：US11172569B2
公开(公告)日：2021-11-09
申请号：US15718507
申请日：2017-09-28
发明人： Yu-Tung Huang , Ming-Hung Chang , Szu-Heng Liu , You-Jen Cho , Yi-Qi Huang , Chun Kuo
IPC分类号： H05K1/02 , H05K3/10 , G01N33/487 , G01N31/00 , G01N33/18 , H05K3/30 , H01L23/498 , H01L23/00 , H01L23/15 , H05K1/11
摘要： A strip for an electronic device senses a liquid sample. The strip includes a substrate having a first surface, a plurality of protrusions disposed on the first surface, and each having a width, and a hydrophilic layer having a layer surface disposed on the first surface and the plurality of protrusions, and having a second surface opposite to the layer surface, whereby the liquid sample and the second surface have a contact angle therebetween ranging from 2 to 85 degrees when the liquid sample is disposed on the hydrophilic layer.
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公开(公告)号：US09807888B2
公开(公告)日：2017-10-31
申请号：US14588321
申请日：2014-12-31
发明人： Yu-Tung Huang , Ming-Hung Chang
IPC分类号： H01L23/02 , H05K3/30 , H01L23/498 , H05K1/11 , H01L23/00
CPC分类号： H05K3/305 , H01L23/49811 , H01L24/13 , H01L24/81 , H01L2224/1319 , H01L2224/16237 , H01L2224/81192 , H01L2224/81385 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H05K1/111 , H05K2201/0373 , H05K2201/09781 , Y02P70/613 , Y10T156/10 , H01L2924/00014
摘要： A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface.
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