发明申请
- 专利标题： CONDUCTING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 导电包装结构及其制造方法
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申请号： US14588321申请日： 2014-12-31
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公开(公告)号： US20150189802A1公开(公告)日： 2015-07-02
- 发明人: Yu-Tung Huang , Ming-Hung Chang
- 申请人： TAI-SAW TECHNOLOGY CO., LTD.
- 优先权： TW102149389 20131231
- 主分类号： H05K13/04
- IPC分类号： H05K13/04 ; H05K3/02 ; H05K3/30 ; H05K1/02
摘要：
A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface.
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