公开(公告)号：US20200350261A1

公开(公告)日：2020-11-05

申请号：US16875240

申请日：2020-05-15

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Po-Hao Wang ,  Chang-Fu Lin ,  Chun-Tang Lin ,  Bo-Hao Chang

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.

公开(公告)号：US20170309579A1

公开(公告)日：2017-10-26

申请号：US15494034

申请日：2017-04-21

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Po-Hao Wang ,  Chang-Fu Lin ,  Chun-Tang Lin ,  Bo-Hao Chang

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31

Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.

公开(公告)号：US11227842B2

公开(公告)日：2022-01-18

申请号：US16875240

申请日：2020-05-15

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Po-Hao Wang ,  Chang-Fu Lin ,  Chun-Tang Lin ,  Bo-Hao Chang

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31

Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.

公开(公告)号：US10763223B2

公开(公告)日：2020-09-01

申请号：US15494034

申请日：2017-04-21

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Po-Hao Wang ,  Chang-Fu Lin ,  Chun-Tang Lin ,  Bo-Hao Chang

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.