公开(公告)号：US12027991B2

公开(公告)日：2024-07-02

申请号：US18003559

申请日：2021-05-14

Applicant: Siemens Aktiengesellschaft

Inventor： Franziska Lambrecht ,  Markus Schwarz ,  Harald Schweigert ,  Jörg Zapf

IPC: H02M7/32 ,  H02M1/42 ,  H02M7/219

CPC classification number: H02M7/32 ,  H02M1/42 ,  H02M7/219

Abstract: Various embodiments of the teachings herein include a rectifier. The rectifier may include: a rectifier circuit formed with current valves with microelectromechanical systems (MEMS) switches; and a switching controller driving the MEMS switches to switch and open. The switching controller opens the MEMS switches when a voltage feeding the rectifier falls below a minimum distance from a zero voltage.

公开(公告)号：US20230238894A1

公开(公告)日：2023-07-27

申请号：US18003559

申请日：2021-05-14

Applicant: Siemens Aktiengesellschaft

Inventor： Franziska Lambrecht ,  Markus Schwarz ,  Harald Schweigert ,  Jörg Zapf

IPC: H02M7/32 ,  H02M1/42

CPC classification number: H02M7/32 ,  H02M1/42

Abstract: Various embodiments of the teachings herein include a rectifier. The rectifier may include: a rectifier circuit formed with current valves with microelectromechanical systems (MEMS) switches; and a switching controller driving the MEMS switches to switch and open. The switching controller opens the MEMS switches when a voltage feeding the rectifier falls below a minimum distance from a zero voltage.

公开(公告)号：US11181408B2

公开(公告)日：2021-11-23

申请号：US16367469

申请日：2019-03-28

Applicant: Siemens Aktiengesellschaft

Inventor： Sebastian Kisban ,  Stefan Klehr ,  Thomas Neuhauser ,  Piotr Strauch ,  Jörg Zapf ,  Jürgen Zettner ,  Stefan Von Dosky

IPC: G01F1/69 ,  G01N27/18 ,  G01F1/684 ,  G01N30/64 ,  G01N30/66

Abstract: A thermoresistive gas sensor, e.g. for a flow sensor or a thermal conductivity detector, has a lattice with lattice webs, which consist of a semiconductor material arranged in the plane of the lattice in parallel next to one another, wherein the semiconductor material is formed on a plate-shaped semiconductor substrate that extends over a window-like cutout in the semiconductor substrate and forms the lattice, where the semiconductor layer is doped outside the cutout in areas of two ends of the lattice at least over the width of the lattice until it degenerates and/or bears metallizations, where the semiconductor layer further contains a separation structure insulating the two ends of the lattice from one another, in which the semiconductor material is removed or is not doped, and where the lattice webs extend in an S shape and are connected electrically in parallel to achieve a high measurement sensitivity and mechanical stability.

公开(公告)号：US12082333B2

公开(公告)日：2024-09-03

申请号：US17801358

申请日：2021-01-28

Applicant: Siemens Aktiengesellschaft

Inventor： Hubert Baueregger ,  Albrecht Donat ,  Axel Ganster ,  Franziska Lambrecht ,  Markus Lasch ,  Stefan Stegmeier ,  Erik Weisbrod ,  Jörg Zapf

IPC: H05K1/02 ,  H01L23/367 ,  H05K3/34

CPC classification number: H05K1/0203 ,  H01L23/367 ,  H05K3/34

Abstract: Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.

公开(公告)号：US20240150166A1

公开(公告)日：2024-05-09

申请号：US18548551

申请日：2022-02-21

Applicant: Siemens Aktiengesellschaft

Inventor： Oliver Raab ,  Markus Schwarz ,  Jörg Zapf ,  Hans Santos Wilke

IPC: B81B7/00 ,  B81C1/00 ,  H01H1/00

CPC classification number: B81B7/0041 ,  B81C1/00269 ,  H01H1/0036 ,  B81B2201/014 ,  H01H2001/0084

Abstract: Various embodiments include a microelectromechanical switching element. The element may include: a substrate with a carrier layer, an electrically insulating layer, and a semiconductor layer; a deflectable bending element formed by a freed subregion of the semiconductor layer; and a cover substrate connected to the carrier substrate. The carrier layer defines a first cutout in the region of the bending element. The cover substrate comprises a second cutout and/or an encircling spacer layer in the region of the bending element. The first cutout and the second cutout define a superordinate hollow space in which the bending element is arranged so as to be deflectable. The superordinate hollow space is delimited by the carrier layer and by the cover substrate to provide a hermetically encapsulation from the external environment.

公开(公告)号：US20230074572A1

公开(公告)日：2023-03-09

申请号：US17801358

申请日：2021-01-28

Applicant: Siemens Aktiengesellschaft

Inventor： Hubert Baueregger ,  Albrecht Donat ,  Axel Ganster ,  Franziska Lambrecht ,  Markus Lasch ,  Stefan Stegmeier ,  Erik Weisbrod ,  Jörg Zapf

IPC: H05K1/02 ,  H01L23/367 ,  H05K3/34

Abstract: Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.