摘要:
A ceramic sintered body contains Al2O3 crystal grains, internal TiC crystal grains existing in the Al2O3 crystal grains and external TiC crystal grains other than the internal TiC crystal grains. The Al2O3 crystal grains and the external TiC crystal grains retain stress caused by the difference in thermal expansion coefficient remaining after sintering, so that the Al2O3 crystal grains and the external TiC crystal grains pull each other in the interface therebetween. As a result, when the ceramic sintered body is machined, micro-cracks generated in the interface can easily grow due to the residual stress in addition to the shearing force caused by the machining operation, so that machinability is improved.
摘要翻译:陶瓷烧结体包含Al 2 O 3晶粒,存在于Al 2 O 3晶粒中的内部TiC晶粒和外部TiC晶粒以外的TiC晶粒。 Al 2 O 3晶粒和外部TiC晶粒保持由烧结后剩余的热膨胀系数的差异引起的应力,使得Al 2 O 3晶粒和外部TiC晶粒在其间的界面处相互牵引。 结果,当加工陶瓷烧结体时,除了由机械加工操作引起的剪切力之外,由于残余应力,在界面中产生的微裂纹容易生长,从而提高了切削性。
摘要:
Greater emphasis has been placed on smoothness of the floating surface for the applications with floating height of 10 nm or less. To obtain a smooth floating surface, it must be polished with diamond abrasive having a mean particle size of 0.1 μm or less, and conventional ceramic sintered body has poor machinability and it is impossible to use the magnetic heads made of this ceramic sintered body at a floating height of 10 nm or less.The ceramic sintered body according to the present invention contains Al2O3 crystal grains, internal TiC crystal grains existing in the Al2O3 crystal grains and external TiC crystal grains other than the internal TiC crystal grains. The Al2O3 crystal grains and the external TiC crystal grains retain stress caused by the difference in thermal expansion coefficient remaining after sintering, so that the Al2O3 crystal grains and the external TiC crystal grains pull each other in the interface therebetween. As a result, when the ceramic sintered body is machined, micro-cracks generated in the interface can easily grow due to the residual stress in addition to the shearing force caused by the machining operation, so that machinability is improved.
摘要翻译:对于浮动高度为10nm或更小的应用,浮动表面的光滑度更加重视。 为了获得平滑的浮动表面,必须用平均粒度为0.1μm以下的金刚石磨料抛光,并且常规的陶瓷烧结体具有差的机械加工性,并且不可能使用由该陶瓷烧结体制成的磁头 浮动高度为10nm以下。 根据本发明的陶瓷烧结体包含存在于Al 2 O 3晶粒中的Al 2 O 3晶粒,存在于内部TiC晶粒和外部TiC晶粒以外的TiC晶粒。 Al 2 O 3晶粒和外部TiC晶粒保持由烧结后剩余的热膨胀系数的差异引起的应力,使得Al 2 O 3晶粒和外部TiC晶粒在其间的界面处相互牵引。 结果,当加工陶瓷烧结体时,除了由机械加工操作引起的剪切力之外,由于残余应力,在界面中产生的微裂纹容易生长,从而提高了切削性。
摘要:
A substrate for a magnetic read/write head is disclosed. The substrate can reduce detachment of crystal grains when unexpected vibrations or impacts are applied. The substrate may be machined when the substrate is cut into strips or a flow path surface recess is formed to produce the magnetic read/write head. The reduced detachment of crystal grains makes the magnetic read/write head more resilient to chipping, which allows the magnetic read/write head to have good performance in read/write.
摘要:
A substrate for a magnetic read/write head is disclosed. The substrate can reduce detachment of crystal grains when the substrate is machined. The substrate may be machined when the substrate is cut into strips or a flow path surface recess is formed to produce the magnetic read/write head. The reduced detachment of crystal grains makes the magnetic read/write head more resilient to chipping, which allows the magnetic read/write head to have a lower and more stable flying height that increases recording density.
摘要:
A substrate for a magnetic read/write head is disclosed. The substrate can reduce detachment of crystal grains when the substrate is machined. The substrate may be machined when the substrate is cut into strips or a flow path surface recess is formed to produce the magnetic read/write head. The reduced detachment of crystal grains makes the magnetic read/write head more resilient to chipping, which allows the magnetic read/write head to have a lower and more stable flying height that increases recording density.
摘要:
A circuit substrate in which the conductor portions constituting the functional devices formed in the insulating board have interfacial electric conductivities &sgr; of not larger than 2.90×107 &OHgr;−1·m−1 to greatly lower the insertion losses.
摘要:
A photoelectric conversion device and a method for producing a photoelectric conversion device are disclosed. The photoelectric conversion device includes a light-absorbing layer. The light-absorbing layer contains a chalcopyrite-based compound, and has a peak intensity ratio IB/IA in a range of 3 to 9, where IA represents a peak intensity of the peak formed by combining a peak of a (220) plane and a peak of a (204) plane in X-ray diffraction, and IB represents a peak intensity of a (112) plane.
摘要:
It is an object to provide a photoelectric conversion device with high photoelectric conversion efficiency that improves reliability by increasing contact force between a light absorbing layer and an electrode layer. The photoelectric conversion device includes an electrode layer, and a light absorbing layer located on the electrode layer. The light absorbing layer contains a compound semiconductor. The light absorbing layer comprises a first layer close to the electrode layer and a second layer located on the first layer. The first layer has a void ratio lower than that of the second layer.
摘要:
The object is to improve the conversion efficiency of a photoelectric conversion device. This object can be achieved by a photoelectric conversion device including an electrode and a semiconductor layer which is provided on one main surface of the electrode and contains a I-III-VI group compound semiconductor, wherein the semiconductor layer includes a connection layer that is located at a position on the one main surface side of the electrode and has a tendency that, the closer to the one main surface, the greater a quotient obtained by dividing an amount of substance of a I-B group element by an amount of substance of a III-B group element becomes.
摘要:
The object is to improve the conversion efficiency of a photoelectric conversion device. This object can be achieved by a photoelectric conversion device including an electrode and a semiconductor layer which is provided on one main surface of the electrode and contains a I-III-VI group compound semiconductor, wherein the semiconductor layer includes a connection layer that is located at a position on the one main surface side of the electrode and has a tendency that, the closer to the one main surface, the greater a quotient obtained by dividing an amount of substance of a I-B group element by an amount of substance of a III-B group element becomes.