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公开(公告)号：US11059973B2
公开(公告)日：2021-07-13
申请号：US16523040
申请日：2019-07-26
摘要： Provided are a resin composition capable of yielding a cured product exhibiting a superior heat resistance over a long period of time, and a superior reflow resistance due to a low water absorption rate even at a high temperature; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition containing: (A) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (B) an inorganic filler; and (C) a radical polymerization initiator. The semiconductor device is encapsulated by the cured product of such heat-curable resin composition.
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公开(公告)号：US11001704B2
公开(公告)日：2021-05-11
申请号：US16523345
申请日：2019-07-26
摘要： Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains: (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator.
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公开(公告)号：US10676635B2
公开(公告)日：2020-06-09
申请号：US16168005
申请日：2018-10-23
发明人： Norifumi Kawamura , Shoichi Osada
IPC分类号： C09D163/00 , C08G59/30 , C08G59/32 , H01L23/29 , C08K3/04 , C08K3/36 , C08G59/62 , C08L83/06 , C08G77/14 , C08G77/16
摘要： The invention provides a silicone-modified epoxy resin composition comprising a silicone-modified epoxy resin having at least two epoxy groups, obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane, a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane, black pigment, and an inorganic filler. Because of excellent tracking resistance, the epoxy resin composition is suited for encapsulating semiconductor devices.
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公开(公告)号：US11046848B2
公开(公告)日：2021-06-29
申请号：US16523345
申请日：2019-07-26
摘要： Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains: (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator.
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公开(公告)号：US11028269B2
公开(公告)日：2021-06-08
申请号：US15971019
申请日：2018-05-04
发明人： Norifumi Kawamura , Shoichi Osada , Kohei Otake
IPC分类号： C08L83/06 , H01L33/56 , H01L23/29 , C08L83/10 , C08K5/00 , C08G59/14 , C08G59/40 , C08G59/32 , C08G59/62 , C08G59/30 , C08G77/42 , C08G77/00 , C08G77/14 , C08G77/38 , C08G77/388
摘要： The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.
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公开(公告)号：US10793712B2
公开(公告)日：2020-10-06
申请号：US16502791
申请日：2019-07-03
摘要： Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains: (A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.; (B) a silicone-modified epoxy resin; (C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups; (D) an organic filler; and (E) an anionic curing accelerator.
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公开(公告)号：US20190127580A1
公开(公告)日：2019-05-02
申请号：US16161516
申请日：2018-10-16
摘要： A resin composition comprising a thermosetting resin, an inorganic filler and an organosilicon compound of specific structure is provided. The inorganic filler is briefly treated with the organosilicon compound to have a high affinity to the resin. The composition is improved in flow and impact resistance and suited for encapsulating semiconductor devices.
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