公开(公告)号：US11984327B2

公开(公告)日：2024-05-14

申请号：US17400193

申请日：2021-08-12

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Naoyuki Kushihara ,  Kazuaki Sumita ,  Masahiro Kaneta

IPC分类号： H01L23/29 ,  H01L21/56 ,  H01L23/24 ,  H01L23/31

CPC分类号： H01L21/565 ,  H01L23/24 ,  H01L23/3121

摘要： The present invention is a method for producing a power module, including processes (1) to (4) in the following order: (1) a disposition process of disposing a thermosetting resin composition that is solid at 25° C. into a container housing an insulator substrate with multiple semiconductor components mounted thereon; (2) a melt process involving disposing the container having the thermosetting resin composition disposed therein into a molding apparatus capable of heating, pressurization, and depressurization, and heating the container to melt the thermosetting resin composition; (3) a pressurization-depressurization process of performing one or more depressurizations and one or more pressurizations inside the molding apparatus; and (4) a cure process of heating the inside of the molding apparatus to cure the thermosetting resin composition. This is to provide a method for producing a power module having few voids at the time of molding and excellent reliability.

公开(公告)号：US20190127580A1

公开(公告)日：2019-05-02

申请号：US16161516

申请日：2018-10-16

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Shoichi Osada ,  Norifumi Kawamura ,  Masahiro Kaneta ,  Ryuhei Yokota

IPC分类号： C08L79/08 ,  C08L63/00 ,  C08G18/02 ,  C08K9/06 ,  C08K5/544 ,  C08K5/5419 ,  H01L23/29

摘要： A resin composition comprising a thermosetting resin, an inorganic filler and an organosilicon compound of specific structure is provided. The inorganic filler is briefly treated with the organosilicon compound to have a high affinity to the resin. The composition is improved in flow and impact resistance and suited for encapsulating semiconductor devices.