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    Flux
    2.
    发明申请
    Flux 审中-公开

    公开(公告)号：US20180339375A1

    公开(公告)日：2018-11-29

    申请号：US15988257

    申请日：2018-05-24

    Applicant: Senju Metal Industry Co., Ltd.

    Inventor： Daisuke Maruko ,  Atsumi Takahashi ,  Hiroki Sudo ,  Hiroyoshi Kawasaki ,  Takahiro Hattori ,  Takahiro Roppongi ,  Daisuke Soma ,  Takashi Hagiwara ,  Isamu Sato ,  Yuji Kawamata

    IPC: B23K35/36

    Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

    Resin composition and flux
    6.
    发明授权
    Resin composition and flux 有权

    公开(公告)号：US10160827B2

    公开(公告)日：2018-12-25

    申请号：US15522883

    申请日：2015-10-14

    Applicant: Senju Metal Industry Co., Ltd.

    Inventor： Daisuke Maruko ,  Atsumi Takahashi ,  Takayuki Yoshida

    IPC: C08G59/00 ,  C08G59/40 ,  C08K5/09 ,  C08L101/00 ,  C08G63/06 ,  C08G59/42

    Abstract: A resin composition having an adhesive property in a high temperature range that is estimated during soldering, and flux using this resin composition, a flux residue of which is washable. The resin composition contains a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule and a thermosetting resin in a ratio of 1:3 or more and 1:7 or less. Further, the flux contains the hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule in an amount of 8.5% by mass or more and 16% by mass or less, and a thermosetting resin in an amount of 50% by mass or more and 60% by mass or less, wherein a ratio between the hydroxyl carboxylic acid and the thermosetting resin is 1:7 or less.

    Flux
    7.
    发明授权
    Flux 有权

    公开(公告)号：US10583533B2

    公开(公告)日：2020-03-10

    申请号：US15999473

    申请日：2017-02-16

    Applicant: Senju Metal Industry Co., Ltd.

    Inventor： Daisuke Maruko ,  Atsumi Takahashi ,  Hiroyoshi Kawasaki

    IPC: B23K35/362 ,  C08G65/333 ,  C08K5/17 ,  C08K5/09 ,  B23K35/36 ,  B23K101/36

    Abstract: Provided is a flux that is able to suppress any solder bridges even when it is applied to the narrow pitched electrodes such that the bridge occurs when using the past flux. The flux is characterized by containing 15% by mass or more and 35% by mass or less of polyoxyalkylene ethylenediamine, 2% by mass or more and 15% by mass or less of an organic acid, 10% by mass or more and 30% by mass or less of a base material, 3% by mass or more and 30% by mass or less of an amine and 20% by mass or more and 40% by mass or less of a solvent.

    Flux
    8.
    发明申请
    Flux 审中-公开

    公开(公告)号：US20190210167A1

    公开(公告)日：2019-07-11

    申请号：US15999473

    申请日：2017-02-16

    Applicant: Senju Metal Industry Co., Ltd.

    Inventor： Daisuke Maruko ,  Atsumi Takahashi ,  Hiroyoshi Kawasaki

    IPC: B23K35/362 ,  C08G65/333 ,  C08K5/09 ,  C08K5/17

    Abstract: Provided is a flux that is able to suppress any solder bridges even when it is applied to the narrow pitched electrodes such that the bridge occurs when using the past flux. The flux is characterized by containing 15% by mass or more and 35% by mass or less of polyoxyalkylene ethylenediamine, 2% by mass or more and 15% by mass or less of an organic acid, 10% by mass or more and 30% by mass or less of a base material, 3% by mass or more and 30% by mass or less of an amine and 20% by mass or more and 40% by mass or less of a solvent.

    Resin Composition and Flux
    9.
    发明申请
    Resin Composition and Flux 审中-公开

    公开(公告)号：US20170321000A1

    公开(公告)日：2017-11-09

    申请号：US15522883

    申请日：2015-10-14

    Applicant: Senju Metal Industry Co., Ltd.

    Inventor： Daisuke Maruko ,  Atsumi Takahashi ,  Takayuki Yoshida

    IPC: C08G59/40 ,  C08G63/06

    CPC classification number: C08G59/4028 ,  C08G59/42 ,  C08G59/423 ,  C08G63/06 ,  C08K5/09 ,  C08L101/00

    Abstract: A resin composition having an adhesive property in a high temperature range that is estimated during soldering, and flux using this resin composition, a flux residue of which is washable. The resin composition contains a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule and a thermosetting resin in a ratio of 1:3 or more and 1:7 or less. Further, the flux contains the hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule in an amount of 8.5% by mass or more and 16% by mass or less, and a thermosetting resin in an amount of 50% by mass or more and 60% by mass or less, wherein a ratio between the hydroxyl carboxylic acid and the thermosetting resin is 1:7 or less.

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