公开(公告)号：US20240417244A1

公开(公告)日：2024-12-19

申请号：US18701399

申请日：2022-09-20

Applicant: Schott AG

Inventor： Jens Ulrich Thomas ,  Antti Määttänen ,  Petri Rokka

IPC: B81C1/00 ,  B23K26/21 ,  B23K101/40 ,  H01L21/54 ,  H01L21/78 ,  H01L23/06 ,  H01L23/12

Abstract: An enclosure is shown, comprising at least a first substrate having an outer surface and a second substrate having an outer surface, wherein the first substrate and the second substrate are arranged next to each other in such a way, that an inner surface of the first substrate is adjacent to an inner surface of the second substrate, wherein the second substrate is transparent at least in part and/or at least for a bandwidth of wavelengths, at least one laser weld zone containing an information pattern in the enclosure, wherein the at least one laser weld zone extends from within the first substrate to within the second substrate and permanently joins the first substrate to the second substrate.

公开(公告)号：US20230274991A1

公开(公告)日：2023-08-31

申请号：US18312275

申请日：2023-05-04

Applicant: Schott AG ,  SCHOTT Primoceler Oy

Inventor： Jens Ulrich Thomas ,  Antti Määttänen ,  Petri Rokka

IPC: H01L23/10 ,  B23K26/28 ,  B23K26/03 ,  B23K31/12 ,  H01L21/50

CPC classification number: H01L23/10 ,  B23K26/28 ,  B23K26/032 ,  B23K31/125 ,  H01L21/50 ,  B23K2103/18

Abstract: A process for producing and/or checking an assembly of a substrate stack includes: planarly arranging at least one first substrate against a second substrate to form the substrate stack, the at least one first substrate and the second substrate being arranged directly against one another or on one another, so that at least one contact area is formed between the least one first substrate and the second substrate at which the at least one first substrate is in direct planar contact with the second substrate, the at least one first substrate including a transparent material; detecting a radiative reflection which comes about through irradiation of the substrate stack with a radiative input on the at least one contact area; and ascertaining a first bond quality index (Q1) of the contact area from the radiative reflection.