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公开(公告)号：US20220348457A1
公开(公告)日：2022-11-03
申请号：US17865062
申请日：2022-07-14
Applicant: Schott AG
Inventor： Thomas Zetterer , Antti Määttänen , Jens Ulrich Thomas , Robert Hettler , Yutaka Onezawa
Abstract: A method for providing a plurality of hermetically sealed packages, including the steps of: providing at least two substrates including a first substrate and a second substrate, at least one of the at least two substrates being a transparent substrate, the two substrates being arranged directly adjoining each other or on top of one another, the transparent substrate defining a circumferential rim and an upper side of each package, the bottom of the package being defined by the second substrate, a respective contact area being defined at contact surfaces between the two substrates; sealing each functional area in a hermetically tight manner by bonding the two substrates along the contact area of each package; and dicing each package by a cutting step or a separating step, a particle jet being used to abrasively remove a material from the transparent substrate by the particle jet.
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公开(公告)号：US20250033853A1
公开(公告)日：2025-01-30
申请号：US18707051
申请日：2022-10-14
Applicant: Schott AG
Inventor： Jens Ulrich Thomas , Antti Määttänen , Heidi Lundén , Ville Polojarvi , Thomas Zetterer , Kurt Nattermann
Abstract: A hermetically sealed enclosure is shown, comprising at least a first substrate and a second substrate, a function zone that is circumferentially enclosed in the enclosure, wherein the second substrate is transparent at least in part and/or at least for a bandwidth of wavelengths, at least one laser weld line to hermetically weld the substrates of the enclosure with each other and/or to hermetically seal the function zone, and at least one reduction zone for reducing an amount of molecules in the function zone.
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公开(公告)号：US20240417244A1
公开(公告)日：2024-12-19
申请号：US18701399
申请日：2022-09-20
Applicant: Schott AG
Inventor： Jens Ulrich Thomas , Antti Määttänen , Petri Rokka
Abstract: An enclosure is shown, comprising at least a first substrate having an outer surface and a second substrate having an outer surface, wherein the first substrate and the second substrate are arranged next to each other in such a way, that an inner surface of the first substrate is adjacent to an inner surface of the second substrate, wherein the second substrate is transparent at least in part and/or at least for a bandwidth of wavelengths, at least one laser weld zone containing an information pattern in the enclosure, wherein the at least one laser weld zone extends from within the first substrate to within the second substrate and permanently joins the first substrate to the second substrate.
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公开(公告)号：US11993511B2
公开(公告)日：2024-05-28
申请号：US17648007
申请日：2022-01-14
Applicant: Schott AG
Inventor： Jens Ulrich Thomas , Thomas Zetterer , Antti Määttänen , Robert Hettler , Yutaka Onezawa
CPC classification number: B81B7/0058 , B81C1/00333 , B81C2203/0118 , B81C2203/0163
Abstract: A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.
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公开(公告)号：US20230274991A1
公开(公告)日：2023-08-31
申请号：US18312275
申请日：2023-05-04
Applicant: Schott AG , SCHOTT Primoceler Oy
Inventor： Jens Ulrich Thomas , Antti Määttänen , Petri Rokka
CPC classification number: H01L23/10 , B23K26/28 , B23K26/032 , B23K31/125 , H01L21/50 , B23K2103/18
Abstract: A process for producing and/or checking an assembly of a substrate stack includes: planarly arranging at least one first substrate against a second substrate to form the substrate stack, the at least one first substrate and the second substrate being arranged directly against one another or on one another, so that at least one contact area is formed between the least one first substrate and the second substrate at which the at least one first substrate is in direct planar contact with the second substrate, the at least one first substrate including a transparent material; detecting a radiative reflection which comes about through irradiation of the substrate stack with a radiative input on the at least one contact area; and ascertaining a first bond quality index (Q1) of the contact area from the radiative reflection.
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Patent Agency Ranking
公开(公告)号：US20230128755A1
公开(公告)日：2023-04-27
申请号：US18088035
申请日：2022-12-23
Applicant: Schott AG
Inventor： Antti Määttänen , Jens Ulrich Thomas
Abstract: A hermetically sealed package includes: at least one cover substrate which is sheet-like and includes a flat outer surface and a circumferential narrow side, the at least one cover substrate being formed as a transparent thin film substrate, the at least one cover substrate having a thickness of less than 200 μm; a second substrate which is adjoined to the at least one cover substrate and in direct contact with the at least one cover substrate; at least one functional area enclosed by the hermetically sealed package, the at least one functional area being between the at least one cover substrate and the second substrate; and a laser bonding line which joins the at least one cover substrate and the second substrate directly and in a hermetically tight manner.
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公开(公告)号：US20220144627A1
公开(公告)日：2022-05-12
申请号：US17582514
申请日：2022-01-24
Applicant: Schott AG
Inventor： Jens Ulrich Thomas , Thomas Zetterer , Yutaka Onezawa , Antti Määttänen , Kurt Nattermann , Robert Hettler
Abstract: A hermetically sealed package includes: at least one cover substrate and a substrate arranged so as to adjoin the at least one cover substrate, which together define at least part of the package, the at least one cover substrate being in a thermally prestressed state and bonded to the substrate adjoining the at least one cover substrate in a hermetically sealing manner by at least one laser bonding line, the at least one cover substrate being made of a material which has a different characteristic value of a coefficient of thermal expansion than the adjoining substrate and a thermal prestress is established in the package; and at least one functional area enclosed in the package.
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公开(公告)号：US20220135398A1
公开(公告)日：2022-05-05
申请号：US17648007
申请日：2022-01-14
Applicant: Schott AG
Inventor： Jens Ulrich Thomas , Thomas Zetterer , Antti Määttänen , Robert Hettler , Yutaka Onezawa
Abstract: A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.
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公开(公告)号：US11975962B2
公开(公告)日：2024-05-07
申请号：US17582514
申请日：2022-01-24
Applicant: Schott AG
Inventor： Jens Ulrich Thomas , Thomas Zetterer , Yutaka Onezawa , Antti Määttänen , Kurt Nattermann , Robert Hettler
CPC classification number: B81B7/0058 , B81C1/00333 , B81C2203/0118
Abstract: A hermetically sealed package includes: at least one cover substrate and a substrate arranged so as to adjoin the at least one cover substrate, which together define at least part of the package, the at least one cover substrate being in a thermally prestressed state and bonded to the substrate adjoining the at least one cover substrate in a hermetically sealing manner by at least one laser bonding line, the at least one cover substrate being made of a material which has a different characteristic value of a coefficient of thermal expansion than the adjoining substrate and a thermal prestress is established in the package; and at least one functional area enclosed in the package.
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10.发明公开公开(公告)号：US20230348324A1
公开(公告)日：2023-11-02
申请号：US18349555
申请日：2023-07-10
Applicant: SCHOTT AG
Inventor： Andreas Ortner , Fabian Wagner , Markus Heiss-Chouquet , Michael Drisch , Vanessa Glässer , Annika Hörberg , Ulrich Peuchert , Jens Ulrich Thomas , Ville Polojarvi , Antti Määttänen
CPC classification number: C03C23/0025 , C03C15/00
Abstract: A platelike glass element is provided that includes a first surface, a second surface opposite the first, and a hole that perforates the first surface. The first surface has, at least partially around the hole, has a feature selected from a group consisting of: a height deviation with respect to the first surface that is greater than 0.005 μm, is greater than 0.05 μm, less than 0.1 μm, less than 0.3 μm, a less than 0.5 μm, and combinations thereof. The first surface has an average roughness value that is less than 15 nm. The edge between the first surface and the hole that is free of elevations.
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