PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
    印刷电路板及其制造方法

    公开(公告)号:US20130153280A1

    公开(公告)日:2013-06-20

    申请号:US13425622

    申请日:2012-03-21

    Abstract: Disclosed herein is a printed circuit board including: a substrate; first upper and lower insulating layers covering upper and lower sides of the substrate; a via penetrating the substrate and the first upper and lower insulating layers to form an electrical connection; and second upper and lower insulating layers covering or surrounding the via, wherein the first upper and lower insulating layers or the second upper and lower insulating layers include a general circuit region including general circuit patterns and circuit patterns connected to the via and a microcircuit region including microcircuit patterns having a smaller circuit line width than that of the general circuit region.

    Abstract translation: 本文公开了一种印刷电路板,包括:基板; 第一上下绝缘层覆盖基板的上侧和下侧; 穿过基板和第一上绝缘层和下绝缘层的通孔以形成电连接; 以及覆盖或围绕通孔的第二上绝缘层和下绝缘层,其中第一上绝缘层或下绝缘层或第二上绝缘层和下绝缘层包括通用电路区域,其包括通常的电路图案和连接到通孔的电路图案,以及微电路区域, 电路线宽比通常的电路区域小的微电路图形。

    OPTICAL ELEMENT PACKAGE AND SUBSTRATE COMPRISING THE SAME
    4.
    发明申请
    OPTICAL ELEMENT PACKAGE AND SUBSTRATE COMPRISING THE SAME 审中-公开
    光学元件封装和包含该元件的基板

    公开(公告)号:US20100316329A1

    公开(公告)日:2010-12-16

    申请号:US12552918

    申请日:2009-09-02

    CPC classification number: G02B6/4214 G02B6/43

    Abstract: Disclosed herein is an optical element package substrate configured such that electric wiring substrates having a cavity are layered on both sides of an optical waveguide, an optical element package is mounted in the electric wiring substrates, and an optical element mounted on the surface of the optical element package is housed in the cavity, so that the distance between the optical element and the optical waveguide is decreased, thereby increasing optical connection efficiency.

    Abstract translation: 这里公开了一种光学元件封装基板,其被构造成使得具有空腔的电布线基板层叠在光波导的两侧,光学元件封装安装在电布线基板中,并且安装在光学器件的表面上的光学元件 元件封装容纳在空腔中,使得光学元件和光波导之间的距离减小,从而提高光学连接效率。

    Printed circuit board including optical waveguide and method of manufacturing the same
    5.
    发明申请
    Printed circuit board including optical waveguide and method of manufacturing the same 失效
    包括光波导的印刷电路板及其制造方法

    公开(公告)号:US20090290832A1

    公开(公告)日:2009-11-26

    申请号:US12216995

    申请日:2008-07-14

    CPC classification number: G02B6/43 G02B6/132 G02B6/4214 H05K1/0274 H05K3/4602

    Abstract: Disclosed herein is a printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method of the present invention creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption.

    Abstract translation: 这里公开了包括光波导的印刷电路板和制造该板的方法。 在该板中,光波导包括与构成在光波导中形成的反射镜的金属层一体连接的金属层延伸部。 由于本发明的方法使用通常用于制造一般印刷电路板的工艺中的化学镀的镜子,所以适用于制造面积大的印刷电路板,并且镜具有高反射率和 在材料消耗方面效率高。

    Printed circuit board for optical waveguide and method of manufacturing the same
    6.
    发明申请
    Printed circuit board for optical waveguide and method of manufacturing the same 有权
    光波导用印刷电路板及其制造方法

    公开(公告)号:US20090232467A1

    公开(公告)日:2009-09-17

    申请号:US12155755

    申请日:2008-06-09

    CPC classification number: G02B6/1221 G02B2006/1219 H05K1/0274

    Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

    Abstract translation: 这里公开了一种用于光波导的印刷电路板,包括基板和形成在基板上的光波导。 光波导包括形成在基板上的下包层,形成在下包层上并具有芯形成通孔的绝缘层,形成在下包层的区域上的芯部,其暴露于 所述通孔和形成在所述通孔中和所述绝缘层上的上覆层。

    Optoelectronic device having dual-structural nano dot and method for manufacturing the same
    7.
    发明授权
    Optoelectronic device having dual-structural nano dot and method for manufacturing the same 有权
    具有双结构纳米点的光电器件及其制造方法

    公开(公告)号:US06791105B2

    公开(公告)日:2004-09-14

    申请号:US10329269

    申请日:2002-12-24

    Abstract: An optoelectronic device and a method of manufacturing the same which the optoelectronic effect such as light emission or light reception can be increased by forming a dual-structural nano dot to enhance the confinement density of electrons and holes are provided. The optoelectronic device comprises an electron injection layer, a nano dot, and a hole injection layer. The nano dot has a dual structure composed of an external nano dot and an internal dot. The method of manufacturing the optoelectronic device comprises the steps of forming an electron injection layer on a semiconductor substrate; growing nano dot layer on the electron injection layer by an epi-growth method; heating the nano dot layer so that the nano dot has a dual structure composed of an external nano dot and an internal nano dot; and forming a hole injection layer on the overall structure.

    Abstract translation: 提供了通过形成双结构纳米点以增强电子和空穴的限制密度来提高光发射或光接收等光电效应的光电子器件及其制造方法。 光电子器件包括电子注入层,纳米点和空穴注入层。 纳米点具有由外部纳米点和内部点组成的双重结构。 制造光电器件的方法包括以下步骤:在半导体衬底上形成电子注入层; 通过外延生长法在电子注入层上生长纳米点层; 加热纳米点层,使得纳米点具有由外部纳米点和内部纳米点组成的双重结构; 并在整个结构上形成空穴注入层。

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