Leading zero/one anticipator having an integrated sign selector
    1.
    发明授权
    Leading zero/one anticipator having an integrated sign selector 失效
    领先的零/一个预测器具有集成的符号选择器

    公开(公告)号:US06360238B1

    公开(公告)日:2002-03-19

    申请号:US09270469

    申请日:1999-03-15

    IPC分类号: G06F501

    摘要: A zero/one anticipator having an integrated sign selector is disclosed. A leading zeros string and a leading ones string are generated by examining carry propagates, generates, and kills of two adjacent bits of two input operands to an adder within a floating-point processor. The leading zeros string is for a positive sum, and the leading ones string is for a negative sum. A normalization shift amount is then determined from the leading zeros string and the leading ones string. A sign of a sum of the two input operands is then determined separately but concurrently with the normalization shift amount determination process. The sign is then utilized to select either the positive sum or the negative sum for a proper normalization shift amount.

    摘要翻译: 公开了具有集成符号选择器的零/一预测器。 通过检查对浮点处理器内的加法器的两个输入操作数的两个相邻位进行传播,产生和杀死,产生前导零字符串和前导字符串。 前导零字符串为正和,前导字符串为负数。 然后从前导零字符串和前导字符串确定归一化偏移量。 然后分别确定两个输入操作数的和的符号,但与归一化偏移量确定处理同时确定。 然后,利用该符号来选择正和或负的正和归一化移位量。

    6-to-3 carry-save adder
    2.
    发明授权
    6-to-3 carry-save adder 失效
    一个6对3进位保存加法器

    公开(公告)号:US06345286B1

    公开(公告)日:2002-02-05

    申请号:US09182593

    申请日:1998-10-30

    IPC分类号: G06F750

    CPC分类号: G06F7/607 G06F2207/3872

    摘要: A 6-to-3 carry-save binary adder is disclosed. The 6-to-3 carry-save adder includes a means for receiving six data inputs and a means for simultaneously adding the six data inputs to generate a first data output, a second data output, and a third data output. The first data output is a SUM output, the second data output is a CARRY—2 output, and the third data output is a CARRY—4 output.

    摘要翻译: 公开了一种6比3的进位保存二进制加法器。 6对3进位存储加法器包括用于接收六个数据输入的装置和用于同时添加六个数据输入以产生第一数据输出,第二数据输出和第三数据输出的装置。 第一个数据输出是一个SUM输出,第二个数据输出是一个CARRY-2输出,第三个数据输出是一个CARRY-4输出。

    Method and apparatus for anticipating leading digits and normalization shift amounts in a floating-point processor
    3.
    发明授权
    Method and apparatus for anticipating leading digits and normalization shift amounts in a floating-point processor 失效
    用于预测浮点处理器中的前导数字和归一化移位量的方法和装置

    公开(公告)号:US06178437B1

    公开(公告)日:2001-01-23

    申请号:US09139940

    申请日:1998-08-25

    IPC分类号: G06F742

    摘要: A method for anticipating leading zeros/ones in a floating-point processor is disclosed. A leading zeros string and a leading ones string is generated by examining carry propagates, generates, and kills of two adjacent bits of two input operands to an adder within a floating-point processor. The leading zeros string is for a positive sum, and the leading ones string is for a negative sum. A normalization shift amount is calculated directly and concurrently from the leading zeros string and the leading ones strings prior to a determination of a sign of an output of the positive sum and the negative sum.

    摘要翻译: 公开了一种用于预测浮点处理器中的前导零/一个的方法。 通过检查两个输入操作数的两个相邻位的进位传播,生成和杀死浮点处理器内的加法器来产生前导零字符串和前导字符串。 前导零字符串为正和,前导字符串为负数。 在确定正和和负的和的输出的符号之前,从前导零字符串和前导字符串直接并发地计算归一化偏移量。

    High-speed binary adder
    4.
    发明授权
    High-speed binary adder 失效
    高速二进制加法器

    公开(公告)号:US06175852B1

    公开(公告)日:2001-01-16

    申请号:US09114117

    申请日:1998-07-13

    IPC分类号: G06F750

    CPC分类号: G06F7/508

    摘要: A high-speed carry-lookahead binary adder is disclosed. The binary adder includes multiple rows of carry-lookahead circuits, a half-sum module, and a sum/carry module. A first carry-lookahead circuit row includes multiple eight-bit group generate circuits and multiple eight-bit group propagate circuits. Each of the eight-bit group generate circuits produces a generate signal for a corresponding bit location. Each of the eight-bit group propagate circuits produces a propagate signal for a corresponding bit location. The half-sum module is utilized to generate a half-sum signal. By utilizing the half-sum signal, the generate signals, and the propagate signals, the sum/carry module generates sum signals and a carry signal.

    摘要翻译: 公开了一种高速进位 - 前瞻二进制加法器。 二进制加法器包括多行进位查找电路,半和模块和和/进位模块。 第一进位 - 前瞻电路行包括多个8位组生成电路和多个8位组传播电路。 八位组生成电路中的每一个产生相应位位置的生成信号。 八位组传播电路中的每一个产生相应位位置的传播信号。 半和模块用于产生半和信号。 通过利用半和信号,生成信号和传播信号,和/进位模块产生和信号和进位信号。

    Low latency fused multiply-adder
    5.
    发明授权
    Low latency fused multiply-adder 失效
    低延迟融合乘法加法器

    公开(公告)号:US06282557B1

    公开(公告)日:2001-08-28

    申请号:US09207483

    申请日:1998-12-08

    IPC分类号: G06F748

    CPC分类号: G06F7/5443 G06F7/5318

    摘要: A low latency fused multiply-adder for adding a product of a first binary number and a second binary number to a third binary number is disclosed. The low latency fused multiply-adder includes a partial product generation module, a partial product reduction module, and a carry propagate adder. The partial product generation module generates a set of partial products from the first binary number and the second binary number. Coupled to the partial product generation module, the partial product reduction module combines the set of partial products with the third binary number to produce a redundant Sum and a redundant Carry. Finally, the carry propagate adder adds the redundant Sum and the redundant Carry to yield a Sum Total.

    摘要翻译: 公开了一种用于将第一二进制数和第二二进制数的乘积加到第三个二进制数的低延迟融合乘法加法器。 低延迟融合乘法器包括部分乘积生成模块,部分乘积减少模块和进位传播加法器。 部分乘积生成模块从第一二进制数和第二二进制数生成一组部分乘积。 与部分产品生成模块相结合,部分产品减少模块将部分产品集合与第三个二进制数组合,以产生冗余Sum和冗余进位。 最后,进位传播加法器将冗余Sum和冗余Carry相加,得到Sum Total。

    System and method for high-speed register renaming by counting
    6.
    发明授权
    System and method for high-speed register renaming by counting 失效
    通过计数高速寄存器重命名的系统和方法,使用具有飞行中每条指令的寄存器位的表

    公开(公告)号:US06212619B1

    公开(公告)日:2001-04-03

    申请号:US09075918

    申请日:1998-05-11

    IPC分类号: G06F1500

    摘要: A superscalar computer architecture for executing instructions out-of-order, comprising a multiplicity of execution units, a plurality of registers, and a register renaming circuit which generates a list of tags corresponding to specific registers that are not in use during loading of a given instruction. A table is constructed having one bit for each register per instruction in flight. The entries in the table may be combined in a logical OR fashion to create a vector that identifies which registers are in use by instructions that are in flight. Validity bits can also be generated to indicate validity of the generated tags, wherein a generated tag is invalid only if an insufficient number of registers are available during loading of the given instruction. The execution units are preferably pipelined.

    摘要翻译: 一种用于执行无序指令的超标量计算机体系结构,包括多个执行单元,多个寄存器和寄存器重命名电路,该电路生成与给定的加载期间不使用的特定寄存器相对应的标签列表 指令。 在飞行中每个指令的每个寄存器构造一个表。 表中的条目可以以逻辑或或者方式组合,以创建一个向量,用于识别正在飞行中的指令使用哪些寄存器。 也可以生成有效位以指示生成的标签的有效性,其中仅当在给定指令的加载期间没有足够数量的寄存器可用时,所生成的标签才是无效的。 执行单元优选地被流水线化。

    Method and apparatus for generating and logically combining less than
(LT), greater than (GT), and equal to (EQ) condition code bits
concurrently with the execution of an arithmetic or logical operation
    7.
    发明授权
    Method and apparatus for generating and logically combining less than (LT), greater than (GT), and equal to (EQ) condition code bits concurrently with the execution of an arithmetic or logical operation 失效
    用于与执行算术或逻辑运算同时产生和逻辑组合小于(LT),大于(GT)和等于(EQ))条件码位的方法和装置

    公开(公告)号:US6035390A

    公开(公告)日:2000-03-07

    申请号:US5471

    申请日:1998-01-12

    摘要: A processor includes at least an execution unit that executes an instruction by performing an operation indicated by the instruction utilizing one or more operands and condition code logic that determines less than, greater than, and equal to condition code bits associated with the instruction concurrently with execution of the instruction by the execution unit. In one embodiment, the condition code logic includes a single computation stage that receives as inputs individual bit values of bit positions within first and second operands and logically combines the individual bit values. The single computation stage outputs, for each bit position, propagate, generate, and kill signals that collectively indicate values for the less than, greater than, and equal to condition code bits. One or more merging stages coupled to the computation stage then merge the propagate, generate, and kill signals into output signals that set the condition code bits.

    摘要翻译: 处理器至少包括一个执行单元,该执行单元通过使用一个或多个操作数和条件代码逻辑执行指令所指示的操作来执行指令,所述操作数和条件代码逻辑确定小于,大于和等于与执行同时执行的指令相关联的条件代码位 的执行单元的指令。 在一个实施例中,条件码逻辑包括单个计算阶段,其接收第一和第二操作数中的比特位置的各个比特值作为输入,并逻辑地组合各个比特值。 对于每个位位置,单个计算级输出传播,产生和去除共同指示小于,大于和等于条件码位的值的信号。 耦合到计算阶段的一个或多个合并阶段然后将传播,生成和终止信号合并到设置条件码位的输出信号中。

    At-speed scan testing
    8.
    发明授权
    At-speed scan testing 失效
    高速扫描测试

    公开(公告)号:US6014763A

    公开(公告)日:2000-01-11

    申请号:US7670

    申请日:1998-01-15

    IPC分类号: G01R31/28

    CPC分类号: G01R31/318572

    摘要: A method of scanning an integrated circuit, by converting a parallel scan input (scan data and scan control) to serial, passing the serial scan input through scan circuitry to create a serial scan output, converting the scan output from serial to parallel, transmitting the scan output in parallel from the integrated circuit to the tester. A tester clock signal is derived by synchronizing the tester to a divided clock signal (1/N) of the integrated circuit. Communications take place at a speed of the tester clock signal, but the scan operates at the full operational speed of the device under test. At-speed scan testing can be achieved for speeds in excess of 1 GHz.

    摘要翻译: 通过将并行扫描输入(扫描数据和扫描控制)转换为串行扫描来扫描集成电路的方法,将串行扫描输入通过扫描电路传送以创建串行扫描输出,将扫描输出从串行转换为并行转换, 从集成电路并行扫描输出到测试仪。 通过将测试仪与集成电路的分频时钟信号(1 / N)同步,得到测试仪时钟信号。 通信以测试仪时钟信号的速度进行,但扫描以被测设备的全部操作速度运行。 对于超过1 GHz的速度,可以实现高速扫描测试。

    Method for integrated circuit power and electrical connections via through-wafer interconnects
    9.
    发明授权
    Method for integrated circuit power and electrical connections via through-wafer interconnects 有权
    用于通过晶片间互连的集成电路电源和电气连接的方法

    公开(公告)号:US06221769B1

    公开(公告)日:2001-04-24

    申请号:US09263031

    申请日:1999-03-05

    IPC分类号: H01L2144

    摘要: A method for providing a through wafer connection to an integrated circuit silicon package. A hole is first created in the silicon package with an inner surface area extending from the bottom surface of the silicon package to the top surface of the silicon package. The hole is created by one of two methods. The first involves mechanical drilling with a diamond bit rotated at a high rate of speed. The second involves ultrasonically milling utilizing a slurry and steel fingers. The inner surface area of the hole is covered with an insulating material to insulate the conductive material which is later deposited and to serve as a diffusion barrier, then a seed material is placed in the hole. Finally, the hole is filled with a conductive material which is utilized to provide large power inputs or signaling connections to the integrated circuit chips.

    摘要翻译: 一种用于向集成电路硅封装提供贯穿晶片连接的方法。 首先在硅封装中产生一个孔,其中内表面区域从硅封装的底表面延伸到硅封装的顶表面。 孔由两种方法之一创建。 第一个涉及以高速度旋转的钻石钻头的机械钻孔。 第二个涉及使用浆料和钢指的超声波铣削。 孔的内表面积被绝缘材料覆盖,以使稍后沉积的导电材料绝缘并用作扩散阻挡层,然后种子材料放置在孔中。 最后,孔填充有导电材料,该导电材料用于提供大的功率输入或信号连接到集成电路芯片。

    Silicon on silicon package with precision align macro
    10.
    发明授权
    Silicon on silicon package with precision align macro 有权
    硅芯片封装,精确对准宏

    公开(公告)号:US6166437A

    公开(公告)日:2000-12-26

    申请号:US290921

    申请日:1999-04-12

    摘要: A silicon wafer is etched to form a first and second series of guidance features. The features of the first series are larger than and surround the features of the second series. The second series is clustered into groups and a hole is formed in the center of each group. The wafer is designed to integrate a silicon package having preformed contacts with a plurality of silicon-based chips. The package and each chip has a series of guidance recesses which correspond to the guidance features of the first and second series, respectively. One chip is placed on top of each group of the second series, and the package is placed on top of the first series. The recesses in the package and chips will precisely align with and slidingly engage the upper ends of the features. Since the features of the first series are larger than those of the second series, there is a clearance between the package and the chips. In the final stage of assembly, the package is restrained from movement and a pin is inserted through each hole in the wafer to force the chips into contact with the contacts on the package. Heat is then applied to fuse solder balls on the chips with the contacts to form a complete and finished assembly.

    摘要翻译: 蚀刻硅晶片以形成第一和第二系列的引导特征。 第一系列的特征大于第二系列的特征并且围绕着第二系列的特征。 第二个系列分组成群,在每组的中心形成一个孔。 晶片被设计成将具有预成型触点的硅封装与多个硅基芯片集成。 封装和每个芯片具有一系列引导凹槽,其分别对应于第一和第二系列的引导特征。 一个芯片放置在第二个系列的每个组的顶部,并且包装被放置在第一系列的顶部。 封装和芯片中的凹槽将精确地对准并滑动地接合特征的上端。 由于第一系列的特征大于第二系列的特征,所以封装和芯片之间存在间隙。 在组装的最后阶段,封装被限制移动,并且销穿过晶片中的每个孔,以迫使芯片与封装上的触点接触。 然后施加热量以使具有触头的芯片上的焊球熔合以形成完整和完成的组件。