摘要:
A zero/one anticipator having an integrated sign selector is disclosed. A leading zeros string and a leading ones string are generated by examining carry propagates, generates, and kills of two adjacent bits of two input operands to an adder within a floating-point processor. The leading zeros string is for a positive sum, and the leading ones string is for a negative sum. A normalization shift amount is then determined from the leading zeros string and the leading ones string. A sign of a sum of the two input operands is then determined separately but concurrently with the normalization shift amount determination process. The sign is then utilized to select either the positive sum or the negative sum for a proper normalization shift amount.
摘要:
A 6-to-3 carry-save binary adder is disclosed. The 6-to-3 carry-save adder includes a means for receiving six data inputs and a means for simultaneously adding the six data inputs to generate a first data output, a second data output, and a third data output. The first data output is a SUM output, the second data output is a CARRY—2 output, and the third data output is a CARRY—4 output.
摘要:
A method for anticipating leading zeros/ones in a floating-point processor is disclosed. A leading zeros string and a leading ones string is generated by examining carry propagates, generates, and kills of two adjacent bits of two input operands to an adder within a floating-point processor. The leading zeros string is for a positive sum, and the leading ones string is for a negative sum. A normalization shift amount is calculated directly and concurrently from the leading zeros string and the leading ones strings prior to a determination of a sign of an output of the positive sum and the negative sum.
摘要:
A high-speed carry-lookahead binary adder is disclosed. The binary adder includes multiple rows of carry-lookahead circuits, a half-sum module, and a sum/carry module. A first carry-lookahead circuit row includes multiple eight-bit group generate circuits and multiple eight-bit group propagate circuits. Each of the eight-bit group generate circuits produces a generate signal for a corresponding bit location. Each of the eight-bit group propagate circuits produces a propagate signal for a corresponding bit location. The half-sum module is utilized to generate a half-sum signal. By utilizing the half-sum signal, the generate signals, and the propagate signals, the sum/carry module generates sum signals and a carry signal.
摘要:
A low latency fused multiply-adder for adding a product of a first binary number and a second binary number to a third binary number is disclosed. The low latency fused multiply-adder includes a partial product generation module, a partial product reduction module, and a carry propagate adder. The partial product generation module generates a set of partial products from the first binary number and the second binary number. Coupled to the partial product generation module, the partial product reduction module combines the set of partial products with the third binary number to produce a redundant Sum and a redundant Carry. Finally, the carry propagate adder adds the redundant Sum and the redundant Carry to yield a Sum Total.
摘要:
A superscalar computer architecture for executing instructions out-of-order, comprising a multiplicity of execution units, a plurality of registers, and a register renaming circuit which generates a list of tags corresponding to specific registers that are not in use during loading of a given instruction. A table is constructed having one bit for each register per instruction in flight. The entries in the table may be combined in a logical OR fashion to create a vector that identifies which registers are in use by instructions that are in flight. Validity bits can also be generated to indicate validity of the generated tags, wherein a generated tag is invalid only if an insufficient number of registers are available during loading of the given instruction. The execution units are preferably pipelined.
摘要:
A processor includes at least an execution unit that executes an instruction by performing an operation indicated by the instruction utilizing one or more operands and condition code logic that determines less than, greater than, and equal to condition code bits associated with the instruction concurrently with execution of the instruction by the execution unit. In one embodiment, the condition code logic includes a single computation stage that receives as inputs individual bit values of bit positions within first and second operands and logically combines the individual bit values. The single computation stage outputs, for each bit position, propagate, generate, and kill signals that collectively indicate values for the less than, greater than, and equal to condition code bits. One or more merging stages coupled to the computation stage then merge the propagate, generate, and kill signals into output signals that set the condition code bits.
摘要:
A method of scanning an integrated circuit, by converting a parallel scan input (scan data and scan control) to serial, passing the serial scan input through scan circuitry to create a serial scan output, converting the scan output from serial to parallel, transmitting the scan output in parallel from the integrated circuit to the tester. A tester clock signal is derived by synchronizing the tester to a divided clock signal (1/N) of the integrated circuit. Communications take place at a speed of the tester clock signal, but the scan operates at the full operational speed of the device under test. At-speed scan testing can be achieved for speeds in excess of 1 GHz.
摘要:
A method for providing a through wafer connection to an integrated circuit silicon package. A hole is first created in the silicon package with an inner surface area extending from the bottom surface of the silicon package to the top surface of the silicon package. The hole is created by one of two methods. The first involves mechanical drilling with a diamond bit rotated at a high rate of speed. The second involves ultrasonically milling utilizing a slurry and steel fingers. The inner surface area of the hole is covered with an insulating material to insulate the conductive material which is later deposited and to serve as a diffusion barrier, then a seed material is placed in the hole. Finally, the hole is filled with a conductive material which is utilized to provide large power inputs or signaling connections to the integrated circuit chips.
摘要:
A silicon wafer is etched to form a first and second series of guidance features. The features of the first series are larger than and surround the features of the second series. The second series is clustered into groups and a hole is formed in the center of each group. The wafer is designed to integrate a silicon package having preformed contacts with a plurality of silicon-based chips. The package and each chip has a series of guidance recesses which correspond to the guidance features of the first and second series, respectively. One chip is placed on top of each group of the second series, and the package is placed on top of the first series. The recesses in the package and chips will precisely align with and slidingly engage the upper ends of the features. Since the features of the first series are larger than those of the second series, there is a clearance between the package and the chips. In the final stage of assembly, the package is restrained from movement and a pin is inserted through each hole in the wafer to force the chips into contact with the contacts on the package. Heat is then applied to fuse solder balls on the chips with the contacts to form a complete and finished assembly.