Polyamide ester resin, method for preparing the same, and molded article including the same
    1.
    发明授权
    Polyamide ester resin, method for preparing the same, and molded article including the same 有权
    聚酰胺酯树脂,其制备方法和包含该聚酰胺酯树脂的模制品

    公开(公告)号:US09580552B2

    公开(公告)日:2017-02-28

    申请号:US14685927

    申请日:2015-04-14

    IPC分类号: C08G63/02 C08G69/44

    CPC分类号: C08G69/44

    摘要: A polyamide ester resin includes: a repeat unit derived from a dicarboxylic acid; a repeat unit derived from a diamine; and a repeat unit represented by the following Formula 1, wherein the polyamide ester resin has a melting temperature (Tm) of about 280° C. or more. The polyamide ester resin can exhibit excellent properties in terms of moisture absorption resistance, heat resistance, discoloration resistance, fluidity and the like by using a cyclic ester. wherein R1 is a C3 to C12 linear, branched or cyclic alkylene group.

    摘要翻译: 聚酰胺酯树脂包括:衍生自二羧酸的重复单元; 衍生自二胺的重复单元; 和由式1表示的重复单元,其中聚酰胺酯树脂的熔融温度(Tm)为280℃以上。 通过施加环酯,聚酰胺酯树脂在耐吸湿性,耐热性,耐变色性,流动性等方面表现出优异的性能。 其中R 1为C 3〜C 12直链,支链或环状亚烷基。

    Copolymerized polyamide resin, method for preparing the same and molded article comprising the same

    公开(公告)号:US09902808B2

    公开(公告)日:2018-02-27

    申请号:US14583429

    申请日:2014-12-26

    IPC分类号: C08G69/26 C08G69/30

    CPC分类号: C08G69/265 C08G69/30

    摘要: A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R1 is independently a C1 to C5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C1 to C10 hydrocarbon group, R2 and R3 are each independently a C1 to C5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.