-
公开(公告)号：US20230387598A1
公开(公告)日：2023-11-30
申请号：US18446906
申请日：2023-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsub KIM , Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
CPC classification number: H01Q9/0457 , H01Q9/0414 , H01Q21/065
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An antenna structure of a wireless communication system is provided. The antenna structure includes a first radiator, a first printed circuit board (PCB) in which the first radiator is arranged, a plurality of second radiators, a second PCB in which the plurality of second radiators are arranged, and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.
-
公开(公告)号：US20230187833A1
公开(公告)日：2023-06-15
申请号：US18164184
申请日：2023-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Youngsub KIM , Jinhoon KIM , Chunmyung PARK , Youngju LEE , Juneseok LEE , Wangi CHA , Dohyuk HA
Abstract: An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.
-
公开(公告)号：US20220109249A1
公开(公告)日：2022-04-07
申请号：US17496326
申请日：2021-10-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Juneseok LEE , Jinsu HEO , Youngsub KIM , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Kyoungho JEONG , Dohyuk HA
Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
-
公开(公告)号：US20200235469A1
公开(公告)日：2020-07-23
申请号：US16739469
申请日：2020-01-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsub KIM , Jungmin PARK , Dongsik SHIN , Youngju LEE , Jongwook ZEONG
IPC: H01Q1/52
Abstract: An antenna module is provided to reduce the radio waves radiated toward a back lobe of the antenna module, and includes a printed circuit board (PCB) including at least one insulating layer, at least one antenna array disposed on an upper surface of the PCB, and at least one metal structure disposed on the upper surface of the PCB configured to shift a phase of radio waves radiated by the at least one antenna array and flowing along the upper surface of the PCB. The radio wave whose phase is shifted by passing through the metal structure is in a destructive interference relationship with a radio wave which is not affected by the metal structure thereby reducing the radio waves radiated toward a back lobe of the antenna module.
-
公开(公告)号：US20240266716A1
公开(公告)日：2024-08-08
申请号：US18384156
申请日：2023-10-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsub KIM , Juneseok LEE , Kwanghyun BAEK , Jungyub LEE , Dohyuk HA
CPC classification number: H01Q1/246 , H01Q1/2283 , H01Q9/16 , H01Q21/062
Abstract: A radio unit (RU) module may include: a first substrate comprising a first surface and a second surface opposite to the first surface; a radio frequency integrated circuit (RFIC); a second substrate comprising a plurality of layers that comprises a plurality of second layers that comprises at least one first layer; a plurality of antenna elements comprising a first antenna element and a second antenna element; and a plurality of conductivity members comprising a conductivity member. The RFIC may be coupled to the first surface of the first substrate. The second substrate may be coupled to the second surface of the first substrate. The plurality of antenna elements may be disposed on the at least one first layer of the second substrate. The plurality of conductivity members may be disposed across the plurality of second layers of the second substrate.
-
Patent Agency Ranking
公开(公告)号：US20240056520A1
公开(公告)日：2024-02-15
申请号：US18313722
申请日：2023-05-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsub KIM , Jungho PARK , Kwanghyun BAEK , Jungyub LEE , Juneseok LEE , Dohyuk HA
CPC classification number: H04M1/0277 , H05K1/144 , H05K1/028 , H05K2201/041 , H05K2201/10734 , H05K2201/10098
Abstract: In various embodiments, a module for a wireless communication includes: a radiator, a plurality of resonators, a first substrate on which the radiator and the plurality of resonators are disposed, and a second substrate including a power supply. The first substrate includes a plurality of first layers. The second substrate includes a plurality of second layers. The radiator is disposed on a radiation layer of the plurality of first layers of the first substrate. The plurality of resonators is disposed on a resonance layer of the plurality of first layers of the first substrate. At least part of the plurality of resonators in the resonance layer is disposed in an area in the radiation layer, different from an area in which the radiator is disposed.
-
公开(公告)号：US20230129937A1
公开(公告)日：2023-04-27
申请号：US18145550
申请日：2022-12-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsub KIM , Sohyeon JUNG , Kwanghyun BAEK , Youngju LEE , Juneseok LEE , Dohyuk HA
Abstract: An electronic device is provided. The electronic device includes a plurality of antenna arrays, a plurality of first printed circuit board (PCB) sets corresponding to the plurality of the antenna arrays, and a second PCB including a power interface, the second PCB may include a feeding line for delivering signals to the antenna elements, a first layer formed away from a first surface of the feeding line, and a second layer formed away from a second surface of the feeding line, and the second layer may include a metamaterial for transforming impedance.
-
公开(公告)号：US20230019144A1
公开(公告)日：2023-01-19
申请号：US17946688
申请日：2022-09-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juneseok LEE , Youngsub KIM , Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Dohyuk HA , Jinsu HEO
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.
-
公开(公告)号：US20230198167A1
公开(公告)日：2023-06-22
申请号：US18109607
申请日：2023-02-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsub KIM , Junsig KUM , Seungtae KO , Byungchul KIM , Yoongeon KIM , Seungho CHOI , Jungmin PARK , Youngju LEE
CPC classification number: H01Q21/24 , H01Q1/248 , H01Q9/045 , H01Q9/0442
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to embodiments of the disclosure, an antenna module in a wireless communication system may include: a plurality of antenna elements; a first antenna substrate; a second antenna substrate; and a Printed Circuit Board (PCB). A first side of the first antenna substrate may be coupled to each of the plurality of antenna elements, and a second side of the first antenna substrate opposite to the first side of the first antenna substrate may be coupled to the PCB. A first side of the second antenna substrate may be coupled to each of the plurality of antenna elements, and a second side of the second antenna substrate opposite to the first side of the second antenna substrate may be coupled to the PCB. A face between the first side of the first antenna substrate and the second side of the first antenna substrate may face a face between the first side of the second antenna substrate and the second side of the second antenna substrate.
-
公开(公告)号：US20210218141A1
公开(公告)日：2021-07-15
申请号：US17215622
申请日：2021-03-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dongsik SHIN , Youngsub KIM , Seungho CHOI , Jungmin PARK , Jongwook ZEONG , Jonghwa KIM , Youngju LEE
Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to embodiments in the present disclosure, an antenna device for dual polarization of a wireless communication system, comprises a print circuit board (PCB); a first feeding line configured to provide a first polarization signal; a second feeding configured to provide a second polarization signal; and a patch antenna comprising a radiating region and cutting regions. Objects corresponding to the cutting regions are disposed to support the radiating region on the PCB.
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.022 seconds)
