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公开(公告)号:US20230187833A1
公开(公告)日:2023-06-15
申请号:US18164184
申请日:2023-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghyun BAEK , Youngsub KIM , Jinhoon KIM , Chunmyung PARK , Youngju LEE , Juneseok LEE , Wangi CHA , Dohyuk HA
Abstract: An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.