公开(公告)号：US12051629B2

公开(公告)日：2024-07-30

申请号：US16825512

申请日：2020-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghwa Hyun ,  Younghwan Kim ,  Hwayoung Park ,  Youngsu Ryu ,  Yusang Cheon

IPC: H01L21/66 ,  B05D1/00 ,  G01N21/95 ,  G03F7/16 ,  H01L21/67

CPC classification number: H01L22/12 ,  B05D1/005 ,  G01N21/9503 ,  G03F7/162 ,  H01L21/67023

Abstract: A semiconductor device manufacturing system includes a spin coater and a coating layer inspector. The spin coater includes: a chuck, a rotation driver configured to rotate the chuck; and a solution dispenser configured to spray a solution onto a portion of the coating layer formed on an edge portion of the wafer, wherein the coating layer inspector includes an edge inspection camera and an inspection controller configured to determine a radius, eccentricity, and a top-view shape of the coating layer, based on images of the edge portion of the wafer.

公开(公告)号：US20220065618A1

公开(公告)日：2022-03-03

申请号：US17214830

申请日：2021-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongsu Kim ,  Wansung Park ,  Doohyun Cho ,  Sungha Kim ,  Jaeyoun Wi ,  Kijoo Hong ,  Taejoong Kim ,  Youngsu Ryu ,  Kwangsung Lee ,  Min Hong

IPC: G01B11/06 ,  G01N21/95 ,  G01N21/84 ,  G06T7/00

Abstract: A thickness estimation method may include: obtaining a test spectrum image; obtaining test spectrum data; measuring a thickness of a test layer formed on the test substrate at the plurality of positions; generating a regression analysis model using a correlation between the thickness of the test layer and the test spectrum data; obtaining a spectrum image; and estimating a thickness of a target layer over the entire area of the semiconductor substrate by applying the spectrum image to the regression analysis model. The thickness corresponding to the entire area of the semiconductor substrate that is being transferred is estimated using the thickness estimation method according to an exemplary embodiment in the present disclosure, such that whether or not processing is normally performed may be examined without requiring a separate time. In addition, an examination result may be feedbacked to processing equipment to improve production yield.

公开(公告)号：US11668558B2

公开(公告)日：2023-06-06

申请号：US17214830

申请日：2021-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongsu Kim ,  Wansung Park ,  Doohyun Cho ,  Sungha Kim ,  Jaeyoun Wi ,  Kijoo Hong ,  Taejoong Kim ,  Youngsu Ryu ,  Kwangsung Lee ,  Min Hong

IPC: G01B11/06 ,  G01N21/95 ,  G01N21/84 ,  G06T7/00

CPC classification number: G01B11/0633 ,  G01N21/8422 ,  G01N21/9501 ,  G06T7/0004 ,  G01N2021/8427 ,  G06T2207/30148

Abstract: A thickness estimation method may include: obtaining a test spectrum image; obtaining test spectrum data; measuring a thickness of a test layer formed on the test substrate at the plurality of positions; generating a regression analysis model using a correlation between the thickness of the test layer and the test spectrum data; obtaining a spectrum image; and estimating a thickness of a target layer over the entire area of the semiconductor substrate by applying the spectrum image to the regression analysis model. The thickness corresponding to the entire area of the semiconductor substrate that is being transferred is estimated using the thickness estimation method according to an exemplary embodiment in the present disclosure, such that whether or not processing is normally performed may be examined without requiring a separate time. In addition, an examination result may be feedbacked to processing equipment to improve production yield.

公开(公告)号：US20210066140A1

公开(公告)日：2021-03-04

申请号：US16825512

申请日：2020-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghwa Hyun ,  Younghwan Kim ,  Hwayoung Park ,  Youngsu Ryu ,  Yusang Cheon

IPC: H01L21/66 ,  B05D1/00 ,  G03F7/16 ,  G01N21/95 ,  H01L21/67

Abstract: A semiconductor device manufacturing system includes a spin coater and a coating layer inspector. The spin coater includes: a chuck, a rotation driver configured to rotate the chuck; and a solution dispenser configured to spray a solution onto a portion of the coating layer formed on an edge portion of the wafer, wherein the coating layer inspector includes an edge inspection camera and an inspection controller configured to determine a radius, eccentricity, and a top-view shape of the coating layer, based on images of the edge portion of the wafer.