Abstract:
A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.
Abstract:
A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.
Abstract:
A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.
Abstract:
A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.
Abstract:
Provided is a frequency shifting optical swept light source system. The system includes a light source that emits light; an amplifier that amplifies the light output from the light source; an optical converter that shifts a frequency of the amplified light and compresses a spectrum of the amplified light; and a controller that controls a current signal applied to the light source such that a repetition rate of the light output from the light source is adjusted, so that an intensity of the amplified light is adjusted, to thereby adjust a position of the compressed spectrum with respect to a predetermined frequency band.