公开(公告)号：US20240071893A1

公开(公告)日：2024-02-29

申请号：US18124653

申请日：2023-03-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongho SHIN ,  Sangkyu KIM ,  Yoonseok SEO

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/552

CPC classification number: H01L23/49838 ,  H01L23/49822 ,  H01L23/552 ,  H01L24/16 ,  H01L23/49816 ,  H01L23/49866 ,  H01L2224/16227 ,  H01L2924/1434

Abstract: A package substrate includes a plurality of sequentially stacked insulating layers, a first signal line configured to transmit a first signal therethrough, and a ground line. The first signal line including a first signal via at least partially penetrating the plurality of insulating layers, a first signal pad provided at one end of the first signal via in any selected one of the insulating layers, and a first signal wiring extending from the first signal pad in the selected insulating layer. The ground line including a ground via at least partially penetrating the plurality of insulating layers, a ground pad provided at one end of the ground via in the selected insulating layer, a ground wiring extending from the ground pad in the selected insulating layer, and a ground stub extending from the ground pad toward the first signal via or the first signal pad.

公开(公告)号：US20250165093A1

公开(公告)日：2025-05-22

申请号：US18937240

申请日：2024-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonseok SEO ,  Yechung CHUNG

IPC: G06F3/041 ,  G06F3/044 ,  G06K19/07 ,  G06V40/13

Abstract: Provided is a fingerprint sensor package including an anisotropic conductive film including a conductive ball.

公开(公告)号：US20240055335A1

公开(公告)日：2024-02-15

申请号：US18134314

申请日：2023-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangwook PARK ,  Sangkyu KIM ,  Yoonseok SEO ,  Sangnam JEONG

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H10B80/00

CPC classification number: H01L23/49816 ,  H01L23/5383 ,  H01L24/16 ,  H10B80/00 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L24/32 ,  H01L2224/73204 ,  H01L24/73

Abstract: Provided is a semiconductor package including a base substrate, and a first package and a second package mounted apart from each other on an upper surface of the base substrate in a horizontal direction, wherein the second package includes, on each surface thereof, connection pads corresponding to a package ball map including cells, arranged in a plurality of rows and a plurality of columns, each of which has one signal arranged therein, wherein the package ball map includes a first signal, or a data signal, arranged in at least some cells among the cells of the package ball map, and a second signal, or a command or address signal, and the first signal is arranged apart from the second signal.