公开(公告)号：US20240047328A1

公开(公告)日：2024-02-08

申请号：US18341345

申请日：2023-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinduck Park ,  Chansik Kwon ,  Yongseong Kim ,  Inwook Im ,  Jiyeon Han

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49822 ,  H01L25/0657 ,  H01L23/3107 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2924/15184

Abstract: A semiconductor package includes a package base substrate including a substrate cavity formed therein, the substrate cavity extending from a top surface of the package base substrate downwardly toward a bottom surface of the package base substrate. The package base substrate further includes a plurality of base insulating layers, a plurality of substrate wiring patterns extending along at least one of a top surface and a bottom surface of each of the plurality of base insulating layers, and a plurality of substrate conductive vias which pass through at least one of the plurality of base insulating layers and are connected to the plurality of substrate wiring patterns. The semiconductor package further includes a plurality of semiconductor chips disposed at a bottom of the substrate cavity and stacked in a direction perpendicular to a plane of the package base substrate.

公开(公告)号：US11317063B2

公开(公告)日：2022-04-26

申请号：US16995085

申请日：2020-08-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dahee Lee ,  Yongseong Kim ,  Youngmi Jo ,  Dongki Min ,  Wooseok Choi

IPC: H04N9/04 ,  H04N5/355 ,  H04N17/02 ,  H04N17/00

Abstract: An image sensor including a pixel array including a plurality of sub-pixels arranged along a plurality of rows and a plurality of columns, and k number of sub-pixels representing one color pixel in conjunction with each other, where k is an integer equal to or greater than four and calibration circuitry may be provided. The calibration circuitry may be configured to receive digital image signal generated based on pixel signals output from the pixel array, calculate a color gain of the digital image signal based on a coefficient set calculated based on a reference image signal generated by a reference image sensor under a first light source having a first color temperature, store coefficient sets associated with a plurality of color temperatures including the first color temperature, and apply the color gain to the digital image signal to generate a calibrated image signal.