公开(公告)号：US10016833B2

公开(公告)日：2018-07-10

申请号：US14171758

申请日：2014-02-03

申请人： Samsung Electronics Co., Ltd.

发明人： Seok-Yong Lee ,  Yo-Se Eum ,  Tea-Seog Um ,  Kyoung-Bok Cho ,  Jeong-Jin Lee

IPC分类号： B23K3/06

CPC分类号： B23K3/0623

摘要： An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a first diameter, a middle mask layer including a middle opening having a second diameter that is larger than the first diameter, and a lower mask layer.

公开(公告)号：US09113585B2

公开(公告)日：2015-08-18

申请号：US14171992

申请日：2014-02-04

申请人： Samsung Electronics Co., Ltd

发明人： Yo-Se Eum ,  Sang-Geun Kim ,  Seok-Yong Lee

IPC分类号： H01L21/44 ,  H01L21/683 ,  H05K3/34 ,  H01L21/48 ,  H01L23/00 ,  B23K1/00 ,  B23K3/06 ,  B23K3/08

CPC分类号： H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K3/08 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/6838 ,  H01L24/11 ,  H01L2924/0002 ,  H05K2203/041 ,  Y10T29/41 ,  H01L2924/0001

摘要： A method of forming external terminals of a package is provided in which a package substrate may be fixed, an edge portion of the package substrate may be supported to prevent the edge portion of the package substrate from being upwardly bent, a mask having openings may be arranged on the package substrate, and the external terminals may be supplied to the package substrate through the openings of the mask. The supporting portion may downwardly press the edge portion of the package substrate so that the edge portion of the package substrate may not be upwardly bent. As a result, the external terminals on the package substrate may have a uniform thickness.

摘要翻译： 提供一种形成封装的外部端子的方法，其中可以固定封装基​​板，可以支撑封装基板的边缘部分以防止封装基板的边缘部分向上弯曲，具有开口的掩模可以是 布置在封装衬底上，并且可以通过掩模的开口将外部端子提供给封装衬底。 支撑部分可以向下按压封装基板的边缘部分，使得封装基板的边缘部分不会向上弯曲。 结果，封装基板上的外部端子可以具有均匀的厚度。