公开(公告)号：US11962069B2

公开(公告)日：2024-04-16

申请号：US17679284

申请日：2022-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seokwoo Lee ,  Yeonghun Gu ,  Youngho Park ,  Jiwoo Lee ,  Kio Jung ,  Ko Choi ,  Woojin Choi

IPC: H01Q1/24 ,  H01Q1/38 ,  H04M1/02 ,  H04M1/72454

CPC classification number: H01Q1/243 ,  H01Q1/245 ,  H01Q1/38 ,  H04M1/0277 ,  H04M1/72454

Abstract: An electronic device is disclosed, including: a housing including a nonconductive area, a first printed circuit board (PCB) including a cavity and a fill-cut area, overlapping the nonconductive area, a first antenna module including at least one antenna array disposed in the cavity of the first PCB, a support frame coupled to one surface of the first PCB, supporting the first antenna module, a grip sensing pad surrounding the cavity and overlapping the fill-cut area, and a sensing circuit unit electrically connected to the grip sensing pad, configured to control an output power of the first antenna module based on inputs received via the grip sensing pad.

公开(公告)号：US12216498B2

公开(公告)日：2025-02-04

申请号：US17989316

申请日：2022-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeonghun Gu ,  Keunpyo Park ,  Youngho Park ,  Jiwoo Lee ,  Kio Jung ,  Ko Choi ,  Woojin Choi

IPC: G06F1/16 ,  H05K7/14

Abstract: An electronic device according to various embodiments of the disclosure may include a first housing on which a first printed circuit board including a processor is disposed, a second housing on which a second printed circuit board including a display driver for a display is disposed, a hinge structure configured to physically connect the first housing and the second housing such that the first housing and the second housing are foldable/unfoldable, and a cable structure configured to electrically connect the first printed circuit board and the second printed circuit board via the hinge structure. The cable structure may include a first cable configured to transfer display signals and a second cable branched off from the first cable to be grounded to the hinge structure.

公开(公告)号：US11217517B2

公开(公告)日：2022-01-04

申请号：US16835915

申请日：2020-03-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juhyeon Oh ,  Woojin Choi

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10 ,  H01L23/482 ,  H01L23/14 ,  H01L25/065 ,  H01L23/528

Abstract: A semiconductor package may include a substrate having an upper surface on which a plurality of first pads are disposed and a lower surface on which a plurality of second pads are disposed. The semiconductor package may further include a semiconductor chip disposed on the upper surface of the substrate on which connection electrodes connected to a first set of the plurality of first pads are disposed. The semiconductor package may include an interposer having an upper surface on which a plurality of first connection pads, connected to a second set of the plurality of first pads, and a plurality of second connection pads are disposed. The semiconductor package may further include a plurality of connection terminals disposed on a set of the plurality of second connection pads of the interposer, and a molding material disposed on the upper surface of the substrate.