公开(公告)号：US20250087593A1

公开(公告)日：2025-03-13

申请号：US18581596

申请日：2024-02-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juil CHOI ,  Jusuk KANG ,  Jongho PARK ,  Jaeyoung LEE ,  Hyunju LEE ,  Wonho CHOI

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/48

Abstract: A semiconductor package including a first semiconductor chip including a substrate having a front surface and a rear surface opposite to each other, front pads on the front surface, through-electrodes electrically connected to the front pads, passing through the substrate, and protruding onto the rear surface, and rear pads on the through-electrodes, a first dielectric layer covering at least a portion of the first semiconductor chip, the first dielectric layer surrounding, on the rear surface of the substrate, a portion of a side surface of each of the through-electrodes and a side surface of each of the rear pads, on the rear surface of the substrate, at least one first alignment structure within the first dielectric layer around the first semiconductor chip, and a second semiconductor chip on the first dielectric layer may be provided.