公开(公告)号：US10897827B2

公开(公告)日：2021-01-19

申请号：US16750693

申请日：2020-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chongkun Cho ,  Sunggun Cho ,  Wonhee Choi

IPC: H05K5/00 ,  H05K5/02

Abstract: A housing of an electronic device and an electronic device are provided. The housing of an electronic device including at least one plate includes a first surface coupled to at least a portion of a plate of the at least one plate and facing a rear surface of the plate, and a member comprising a second surface being substantially perpendicular to the first surface and facing a side surface of the plate, and wherein the first surface comprises a protrusion protruding from the first surface toward the plate by a predetermined height, a first recess formed in from the first surface by a predetermined depth, and a second recess formed in from the first surface deeper than the first recess.

公开(公告)号：US11956002B2

公开(公告)日：2024-04-09

申请号：US17591712

申请日：2022-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunggun Cho ,  Jongkeun Kim ,  Wonhee Choi ,  Jaehee Kim ,  Hwamok Park ,  Minyee An ,  Dongik Lee

IPC: G06F1/16 ,  H04B1/3888 ,  H04M1/02 ,  H05K1/18 ,  H04B1/38

CPC classification number: H04B1/3888 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1681 ,  H04M1/0277 ,  H05K1/189 ,  H04B2001/3894

Abstract: Disclosed is an electronic device includes a flexible circuit board passing via a first through-hole included in a first housing and a second through-hole included in a second housing, a first support bracket disposed to support the flexible circuit board while covering the first through-hole, a second support bracket disposed to support the flexible circuit board while covering the second through-hole, a first waterproof member disposed to face a partial area of the first through-hole from the first support bracket and inserted into the partial area of the first through-hole, a second waterproof member inserted into the remaining areas of the first through-hole, a third waterproof member disposed to face a partial area of the second through-hole from the second support bracket and inserted into the partial area of the second through-hole, a fourth waterproof member inserted into the remaining areas of the second through-hole.

公开(公告)号：US10860061B2

公开(公告)日：2020-12-08

申请号：US16706006

申请日：2019-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daehyeong Park ,  Jongmin Choi ,  Jaehee Kim ,  Jongkeun Kim ,  Hun Kim ,  Donghyun Byun ,  Uyhyeon Jeong ,  Iksu Jung ,  Sunggun Cho ,  Chongkun Cho ,  Wonhee Choi ,  Seunghyun Hwang ,  Byounguk Yoon ,  Minsung Lee

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00

Abstract: An electronic device is provided that includes a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the front plate and the rear plate and at least partially constructed of a metal material, wherein the front plate includes a first edge having a first length and extending in a third direction, a second edge having a second length longer than the first length and extending in a fourth direction orthogonal to the third direction, a third edge parallel to the first edge, having the first length, and extending in the third direction from the second edge, a fourth edge parallel to the second edge, having the second length, and extending in the fourth direction from the first edge, a first region in which the third edge and the fourth edge meet, and a second region in which the second edge and the third edge meet, a display viewable through the front plate, and an adhesive layer constructed in a closed-curve shape along the first edge, second edge, third edge, and fourth edge of the front plate, wherein, when viewed from above the display, a width of the adhesive layer in the first region and the second region is greater than a width of the adhesive layer outside the first region and the second region.

公开(公告)号：US10082732B2

公开(公告)日：2018-09-25

申请号：US14280900

申请日：2014-05-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungmo Yang ,  Kiwoong Kim ,  Kwangsu Seo ,  Sungjae Lee ,  Yongwoo Jeon ,  Wonhee Choi ,  Byounguk Yoon

IPC: G03F7/00 ,  G03F7/20 ,  B29C37/00 ,  B29C43/02 ,  B29C43/18 ,  B29C35/08 ,  B29C45/16 ,  H05K5/03 ,  H04M1/02

CPC classification number: G03F7/0002 ,  B29C35/0805 ,  B29C37/0053 ,  B29C43/021 ,  B29C43/18 ,  B29C45/1679 ,  B29C2035/0827 ,  B29C2037/0035 ,  B29C2037/0042 ,  G03F7/20 ,  H04M1/0283 ,  H05K5/03 ,  Y10T428/13 ,  Y10T428/1352

Abstract: A surface treatment method of an electronic device is provided. The surface treatment method includes processing a first pattern on a surface of a top mold and a second pattern on a surface of a bottom mold, coating a Ultra-Violet (UV) molding liquid on each of a front surface of a raw sheet material and the bottom mold facing a rear surface of the raw sheet material raw, positioning the raw sheet material between the top mold and the bottom mold, pressing the top mold and the bottom mold to each other, curing the UV molding liquid, and separating the raw sheet material from the top mold and the bottom mold and forming a print layer on the front surface and the rear surface of the raw sheet material.

公开(公告)号：US20240413086A1

公开(公告)日：2024-12-12

申请号：US18387997

申请日：2023-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： JINBUM KIM ,  GUIFU YANG ,  Suk Yang ,  SANGMOON LEE ,  SUNGUK JANG ,  SUNG-HWAN JANG ,  Wonhee Choi

IPC: H01L23/528 ,  H01L29/06 ,  H01L29/08 ,  H01L29/40 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775

Abstract: Provided is a semiconductor device including a lower pattern layer including a first semiconductor material; a first conductivity-type doped pattern layer disposed on the lower pattern layer and including a semiconductor material doped with a first conductivity-type impurity; a source/drain pattern disposed on the first conductivity-type doped pattern layer and including a semiconductor material doped with a second conductivity-type impurity different from the first conductivity-type impurity; a channel pattern including semiconductor patterns connected between the source/drain patterns, stacked apart from each other, and including a second semiconductor material different from the first semiconductor material; and a gate pattern disposed on the first conductivity-type doped pattern layer and between the source/drain patterns, and surrounding the channel pattern.

公开(公告)号：US12072742B2

公开(公告)日：2024-08-27

申请号：US17571672

申请日：2022-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongkeun Kim ,  Sunggun Cho ,  Wonhee Choi ,  Jaehee Kim ,  Hwamok Pak ,  Minyee An

IPC: G06F1/16 ,  H05K5/02 ,  H05K5/03 ,  H05K7/14

CPC classification number: G06F1/1681 ,  G06F1/1618 ,  G06F1/1652 ,  H05K5/0226 ,  H05K5/03 ,  H05K7/1417

Abstract: An electronic device is disclosed, including a hinge connecting to first and second housings as to enable foldability, a flexible display spanning at least a portion of the first housing and the second housing, wherein the flexible display is foldable and unfoldable along with folding and unfolding of the first and second housings, a first sealing member extending as to be disposed between an inner surface of the first housing, an inner surface of the second housing, and an outer surface of the flexible display and an elastic support member disposed between a portion of the flexible display, a portion of the inner surface of the first housing, and a portion of the inner surface of the second housing, within a folding area in which the first housing and the second housing are foldable and unfoldable.

公开(公告)号：US10946958B2

公开(公告)日：2021-03-16

申请号：US15915850

申请日：2018-03-08

Applicant: Samsung Electronics Co., Ltd

Inventor： Sangin Baek ,  Jaeho Kang ,  Seungchul Baek ,  Jongkeun Kim ,  Yeonggyu Yoon ,  Wonhee Choi ,  Hyungil Kim ,  Seunghyun Hwang ,  Minwoo Yoo ,  Byounguk Yoon ,  Jongchul Choi

IPC: B64C39/02 ,  B64C27/00 ,  B64C27/20 ,  B64C39/00

Abstract: An unmanned aerial vehicle is disclosed. The unmanned aerial vehicle includes a frame configured to fix a motor. The unmanned aerial vehicle also includes a housing configured to enclose the frame. The housing includes a top mesh corresponding to an upper surface of the housing and a bottom mesh that covers a portion of a bottom surface of the housing. The housing also includes middle part coupled to the top mesh and the bottom mesh. The housing also includes a plurality of duct areas that penetrate each of the top mesh, the bottom mesh, and the middle part. The motor and a propeller connected to the motor and for rotating are positioned within the duct area.

公开(公告)号：US20200333849A1

公开(公告)日：2020-10-22

申请号：US16850446

申请日：2020-04-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chongkun Cho ,  Jaehee Kim ,  Daehyeong Park ,  Uyhyeon Jeong ,  Sunggun Cho ,  Wonhee Choi ,  Jongmin Choi ,  Seunghyun Hwang

IPC: G06F1/16 ,  G06F1/18

Abstract: An electronic device including a display is provided. The electronic device includes a housing, a display, and a bonding layer. The housing includes a front plate including a flat portion and at least one curved portion bent from a periphery of the flat portion, and disposed to face a first direction, a rear plate disposed to face a second direction that is opposite to the first direction, and a side member including a first surface disposed to face a direction that is perpendicular to the first and second directions, and extending while facing the curved portion and surrounding at least a partial space between the front plate and the rear plate. A first groove is recessed on the first surface in the second direction and in which an edge of the curved portion is accommodated, and a second groove is recessed on the inner side of the housing when viewed from the top of the front plate, the second groove is recessed in the second direction, and to which a bonding liquid is applied.

公开(公告)号：US12200154B2

公开(公告)日：2025-01-14

申请号：US17738550

申请日：2022-05-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunggun Cho ,  Bokgyu Song ,  Wonhee Choi

IPC: H05K1/00 ,  H04M1/02 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic device is provided. The electronic device includes a first housing including a first through hole, a flexible printed circuit board including a plurality of layers, a first portion of the flexible printed circuit board disposed to pass through the through hole, a bonding member being disposed between the plurality of layers constituting the first portion, and a waterproofing member formed to surround at least part of the first portion of the flexible printed circuit board.

公开(公告)号：US11452220B2

公开(公告)日：2022-09-20

申请号：US17152076

申请日：2021-01-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chongkun Cho ,  Sunggun Cho ,  Wonhee Choi

IPC: H05K5/00 ,  H05K5/02

Abstract: A housing of an electronic device and an electronic device are provided. The housing of an electronic device including at least one plate includes a first surface coupled to at least a portion of a plate of the at least one plate and facing a rear surface of the plate, and a member comprising a second surface being substantially perpendicular to the first surface and facing a side surface of the plate, and wherein the first surface comprises a protrusion protruding from the first surface toward the plate by a predetermined height, a first recess formed in from the first surface by a predetermined depth, and a second recess formed in from the first surface deeper than the first recess.