公开(公告)号：US20220026488A1

公开(公告)日：2022-01-27

申请号：US17337066

申请日：2021-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehong Kim ,  Se-Hyun Seo ,  Hyungil Kim ,  Sangjae Rhee ,  Youngchyel Lee

IPC: G01R31/28 ,  H01L21/78 ,  H01L21/66

Abstract: A semiconductor package test system includes a test pack on which a semiconductor package is loaded, and a semiconductor package testing apparatus. The semiconductor package testing apparatus includes a receiving section that receives the test pack. The receiving section includes a pack receiving slot into which the test pack is inserted. The test pack includes a chuck on which the semiconductor package is fixed, a probe block disposed above the chuck, and a connection terminal. The receiving section includes a receiving terminal that is electrically connected to the connection terminal when the receiving terminal contacts the connection terminal. The probe block includes at least one needle configured to be electrically connected to the semiconductor package disposed on the chuck upon the chuck moving toward the semiconductor package. The receiving section is provided in plural.

公开(公告)号：US10946958B2

公开(公告)日：2021-03-16

申请号：US15915850

申请日：2018-03-08

Applicant: Samsung Electronics Co., Ltd

Inventor： Sangin Baek ,  Jaeho Kang ,  Seungchul Baek ,  Jongkeun Kim ,  Yeonggyu Yoon ,  Wonhee Choi ,  Hyungil Kim ,  Seunghyun Hwang ,  Minwoo Yoo ,  Byounguk Yoon ,  Jongchul Choi

IPC: B64C39/02 ,  B64C27/00 ,  B64C27/20 ,  B64C39/00

Abstract: An unmanned aerial vehicle is disclosed. The unmanned aerial vehicle includes a frame configured to fix a motor. The unmanned aerial vehicle also includes a housing configured to enclose the frame. The housing includes a top mesh corresponding to an upper surface of the housing and a bottom mesh that covers a portion of a bottom surface of the housing. The housing also includes middle part coupled to the top mesh and the bottom mesh. The housing also includes a plurality of duct areas that penetrate each of the top mesh, the bottom mesh, and the middle part. The motor and a propeller connected to the motor and for rotating are positioned within the duct area.

公开(公告)号：US11592478B2

公开(公告)日：2023-02-28

申请号：US17337066

申请日：2021-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehong Kim ,  Se-Hyun Seo ,  Hyungil Kim ,  Sangjae Rhee ,  Youngchyel Lee

IPC: G01R31/28 ,  H01L21/78 ,  H01L21/66 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor package test system includes a test pack on which a semiconductor package is loaded, and a semiconductor package testing apparatus. The semiconductor package testing apparatus includes a receiving section that receives the test pack. The receiving section includes a pack receiving slot into which the test pack is inserted. The test pack includes a chuck on which the semiconductor package is fixed, a probe block disposed above the chuck, and a connection terminal. The receiving section includes a receiving terminal that is electrically connected to the connection terminal when the receiving terminal contacts the connection terminal. The probe block includes at least one needle configured to be electrically connected to the semiconductor package disposed on the chuck upon the chuck moving toward the semiconductor package. The receiving section is provided in plural.