公开(公告)号：US10988447B2

公开(公告)日：2021-04-27

申请号：US15632518

申请日：2017-06-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun Sik Chae ,  Kyungdoc Kim ,  Sae Youn Lee ,  Soonok Jeon ,  Hiroshi Miyazaki ,  Masaki Numata ,  Youngmin Nam ,  Tae-Rae Kim ,  In Koo Kim ,  Won-Joon Son ,  Won Seok Oh ,  Younsuk Choi ,  Sunghan Kim ,  Jeong-Ju Cho

IPC: C07D213/22 ,  C09K11/06 ,  H01L51/00 ,  H01L51/50

Abstract: A condensed cyclic compound represented by Formula 1: Ar1-(L1)a1-B-(L2)a2-Ar2  Formula 1 wherein, in Formula 1, groups and variables are the same as described in the specification.

公开(公告)号：US12145782B2

公开(公告)日：2024-11-19

申请号：US17688418

申请日：2022-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wooram Hong ,  Hyun Do Choi ,  Dal Heo ,  Youngchun Kwon ,  Hyukju Kwon ,  Gahee Kim ,  Bosung Kim ,  Jeonghun Kim ,  Jin Woo Kim ,  Min Sik Park ,  Youngjin Park ,  Hyungtae Seo ,  Won Seok Oh ,  Dongseon Lee ,  Sangyoon Lee ,  Jaejun Chang ,  Jun-Won Jang ,  Hyunjeong Jeon ,  Joon-Kee Cho ,  Byung-Kwon Choi ,  Won Je Choi ,  Younsuk Choi ,  Taesin Ha

IPC: B65D51/00 ,  B65D51/20

Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.

公开(公告)号：US12135170B2

公开(公告)日：2024-11-05

申请号：US17888213

申请日：2022-08-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wooram Hong ,  Hyun Do Choi ,  Dal Heo ,  Youngchun Kwon ,  Hyukju Kwon ,  Gahee Kim ,  Bosung Kim ,  Jeonghun Kim ,  Jin Woo Kim ,  Min Sik Park ,  Youngjin Park ,  Hyungtae Seo ,  Won Seok Oh ,  Dongseon Lee ,  Sangyoon Lee ,  Jaejun Chang ,  Jun-Won Jang ,  Hyunjeong Jeon ,  Joon-Kee Cho ,  Byung-Kwon Choi ,  Won Je Choi ,  Younsuk Choi ,  Taesin Ha

IPC: F28D9/00

Abstract: A heat exchanger is provided. The heat exchanger includes a target area that is a target for heat exchange; and a flow path structure. The flow path structure includes at least one inlet; at least one outlet; a first flow path connected to each of the at least one inlet and the at least one outlet, and extending along a first side of the target area; and a second flow path connected to each of the at least one inlet and the at least one outlet, and extending along a second side, different from the first side, of the target area.

公开(公告)号：US20230089079A1

公开(公告)日：2023-03-23

申请号：US17688418

申请日：2022-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wooram HONG ,  Hyun Do Choi ,  Dal Heo ,  Youngchun Kwon ,  Hyukju Kwon ,  Gahee Kim ,  Bosung Kim ,  Jeonghun Kim ,  Jin Woo Kim ,  Min Sik Park ,  Youngjin Park ,  Hyungtae Seo ,  Won Seok Oh ,  Dongseon Lee ,  Sangyoon Lee ,  Jaejun Chang ,  Jun-Woon Jang ,  Hyunjeong Jeon ,  Joon-Kee Cho ,  Byung-Kwon Choi ,  Won Je Choi ,  Younsuk Choi ,  Taesin Ha

IPC: B65D51/00 ,  B65D51/20

Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.