Electronic device including haptic actuator

    公开(公告)号:US11907024B2

    公开(公告)日:2024-02-20

    申请号:US17973014

    申请日:2022-10-25

    IPC分类号: G06F1/16 G06F3/01

    摘要: According to one aspect of the disclosure an electronic device comprises a foldable housing including: a hinge structure, a first housing structure connected to the hinge structure, and including a first face and a second face opposite the first face, and a second housing structure connected to the hinge structure and including a third face and a fourth face opposite the third face, the second housing structure being configured to be rotated about the hinge structure; a flexible display extending over the first face and over the third face; at least one sensor disposed within the foldable housing, and configured to sense an angle formed between the first face and the third face; a first haptic actuator disposed within the first housing structure; a second haptic actuator disposed within the second housing structure; at least one processor disposed within the first housing structure or the second housing structure, and operatively connected to the flexible display, the at least one sensor, the first haptic actuator, and the second haptic actuator. The at least one processor may detect a folding state of the foldable housing using the at least one sensor, and independently control the first haptic actuator and the second haptic actuator based on at least part of the detected folding state.

    Semiconductor memory device capable of increasing flexibility of a column repair operation

    公开(公告)号:US11508456B2

    公开(公告)日:2022-11-22

    申请号:US16685458

    申请日:2019-11-15

    摘要: A semiconductor memory device includes a memory cell array, a bit-line switch, a block switch, and a column decoder. The memory cell array includes memory blocks coupled to at least one word-line and each of the memory blocks includes memory cells. The bit-line switch is connected between a first half local input/output (I/O) line of a first memory block and a second half local I/O line of the first memory block. The block switch is connected between the second half local I/O line of the first memory block and a first half local I/O line of a second memory block adjacent to the first memory block. The column decoder includes a repair circuit that controls connections by applying a first switching control signal to the bit-line switch and a second switching control signal to the block switch.

    Foldable electronic device including magnets

    公开(公告)号:US11204624B2

    公开(公告)日:2021-12-21

    申请号:US16943016

    申请日:2020-07-30

    发明人: Woosik Cho Taewon Kim

    IPC分类号: G06F1/16 H01F7/02

    摘要: An electronic device is provided, which includes a first housing, a second housing, a hinge structure, a flexible display configured to form a front surface of the first housing and the second housing while the electronic device is in an unfolded state, a first support member disposed between the flexible display and the first housing, a first bimetal member disposed between the flexible display and the first support member, a first magnet disposed between the flexible display and the first bimetal member, and a second magnet disposed between the flexible display and the second housing. The first bimetal member has a first length at a first temperature and a second length longer than the first length at a second temperature higher than the first temperature. The first support member has a reception space having a length greater than or equal to the first length and less than the second length that provides space for the first bimetal member to bend at the second temperature.

    FOLDABLE ELECTRONIC DEVICE INCLUDING MAGNETS

    公开(公告)号:US20210034102A1

    公开(公告)日:2021-02-04

    申请号:US16943016

    申请日:2020-07-30

    发明人: Woosik Cho Taewon Kim

    IPC分类号: G06F1/16 H01F7/02

    摘要: An electronic device is provided, which includes a first housing, a second housing, a hinge structure, a flexible display configured to form a front surface of the first housing and the second housing while the electronic device is in an unfolded state, a first support member disposed between the flexible display and the first housing, a first bimetal member disposed between the flexible display and the first support member, a first magnet disposed between the flexible display and the first bimetal member, and a second magnet disposed between the flexible display and the second housing. The first bimetal member has a first length at a first temperature and a second length longer than the first length at a second temperature higher than the first temperature. The first support member has a reception space having a length greater than or equal to the first length and less than the second length that provides space for the first bimetal member to bend at the second temperature.

    MEMORY DEVICES, MEMORY SYSTEMS HAVING THE SAME AND OPERATING METHODS THEREOF

    公开(公告)号:US20240112719A1

    公开(公告)日:2024-04-04

    申请号:US18135822

    申请日:2023-04-18

    发明人: Taewon Kim

    IPC分类号: G11C11/406 G11C11/4078

    摘要: A memory device includes first registers configured to store row addresses second registers configured to store an access count of each of the row addresses and generate a reference value flag signal when the access count is higher than a reference value. The memory device also includes a target row refresh controller configured to select one of the row addresses as a first target row address in response to the reference value flag signal, perform a first refresh operation on at least one first row address adjacent to the first target row address, randomly select one of the row addresses as a second target row address, and perform a second refresh operation on at least one second address adjacent to the second target row address. The second refresh operation may be performed when the reference value flag signal indicates that the access count is not greater than the reference value.

    Foldable electronic device including sliding structure and method for controlling the same

    公开(公告)号:US11550365B2

    公开(公告)日:2023-01-10

    申请号:US16847794

    申请日:2020-04-14

    摘要: According to an embodiment of the disclosure, an electronic device comprises a first housing structure; and a second housing structure hingedly connected to the first housing structure along a hinge axis, wherein a first surface of the first housing structure faces a first surface of the second housing structure in a folded configuration of the electronic device, and the first surface of the first housing structure and the first surface of the second housing structure are planar in an unfolded configuration of the electronic device; a first display disposed on the first surface of the first housing structure and the first surface of the second housing structure, and bendable about the hinge axis; and a sliding structure retractably disposed in the first housing structure, configured to protrude to the outside of the first housing structure in a direction substantially co-planar to the first surface of the first housing structure, the sliding structure comprising at least one optical input module facing a direction substantially orthogonal to the first surface.

    Electronic device including haptic actuator

    公开(公告)号:US11513566B2

    公开(公告)日:2022-11-29

    申请号:US16804165

    申请日:2020-02-28

    IPC分类号: G06F1/16

    摘要: According to one aspect of the disclosure an electronic device comprises a foldable housing including: a hinge structure, a first housing structure connected to the hinge structure, and including a first face and a second face opposite the first face, and a second housing structure connected to the hinge structure and including a third face and a fourth face opposite the third face, the second housing structure being configured to be rotated about the hinge structure; a flexible display extending over the first face and over the third face; at least one sensor disposed within the foldable housing, and configured to sense an angle formed between the first face and the third face; a first haptic actuator disposed within the first housing structure; a second haptic actuator disposed within the second housing structure; at least one processor disposed within the first housing structure or the second housing structure, and operatively connected to the flexible display, the at least one sensor, the first haptic actuator, and the second haptic actuator. The at least one processor may detect a folding state of the foldable housing using the at least one sensor, and independently control the first haptic actuator and the second haptic actuator based on at least part of the detected folding state.

    Electronic device including indicator

    公开(公告)号:US11463563B2

    公开(公告)日:2022-10-04

    申请号:US16829340

    申请日:2020-03-25

    摘要: An electronic device including an indicator is provided. The electronic device includes a first housing structure including a first face oriented in a first direction, and a second face oriented in a second direction opposite the first direction, a second housing structure including a third face oriented in a third direction, and a fourth face oriented in a fourth direction opposite the third direction, a hinge structure rotatably connecting the first housing structure and the second housing structure to each other, the hinge structure configured to provide a folding axis that is a rotating center of the first housing structure and the second housing structure, a flexible display extending from the first face to the third face across the hinge structure, and a hinge case disposed between the first housing structure and the second housing structure to accommodate the hinge structure therein to conceal or protect the hinge structure.

    METHODS OF TESTING REPAIR CIRCUITS OF MEMORY DEVICES

    公开(公告)号:US20240290414A1

    公开(公告)日:2024-08-29

    申请号:US18515681

    申请日:2023-11-21

    IPC分类号: G11C29/44 G11C29/12 G11C29/24

    摘要: A method of testing a repair circuit of a memory device. The method may include storing first addresses in a first register of the repair circuit, wherein the first register is configured to store faulty addresses during a normal operation of the memory device, and the repair circuit is configured to perform a repair operation to replace the faulty addresses with redundancy addresses, storing test addresses in a second register of the repair circuit, wherein the test addresses are provided from a test host, outputting hit signals by comparing bit values of the addresses stored in the first register with bit values of the addresses stored in the second register, outputting repair enable signals based on the hit signals, and determining a status of a path where the repair enable signals are generated based on logic levels of the repair enable signals.