Patent search ap:("Samsung Electronics Co. Page Ltd.") AND inv:"Sung-woo Cho"

1.

发明授权
Aluminum compound, method of forming thin film by using the same, and method of fabricating integrated circuit device 有权

公开(公告)号：US10224200B2

公开(公告)日：2019-03-05

申请号：US15455879

申请日：2017-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyu-hee Park , Jae-soon Lim , Youn-joung Cho , Myong-woon Kim , Sang-ick Lee , Sung-duck Lee , Sung-woo Cho

IPC: H01L21/02 , C07F5/06 , C09D1/00 , C09D5/24 , H01L21/311 , H01L27/11582

Abstract: An aluminum compound is represented by Chemical Formula (I) and is used as a source material for forming an aluminum-containing thin film.

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