公开(公告)号：US20170251564A1

公开(公告)日：2017-08-31

申请号：US15442448

申请日：2017-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Soo Jun ,  Sung-Eun Park ,  Chang-Ok Lim ,  Min-Woo Yoo

IPC: H05K5/06 ,  H04R1/02 ,  H05K5/02

CPC classification number: H05K5/069 ,  H04M1/035 ,  H04M1/18 ,  H04R1/02 ,  H04R1/2853 ,  H04R2499/11 ,  H05K5/0217

Abstract: An electronic device is provided. The electronic device includes a housing including a first surface facing in a first direction, a second surface facing in a second direction opposite to the first direction, and a side surface surrounding at least a part of a space between the first surface and the second surface, an opening formed on at least one of the first surface, the second surface, or the side surface, a first channel extended from the opening, a second channel connected to at least a part of the first channel and extended to an inner space of the housing, an audio mounted inside the housing and connected to the opening through the first channel, a first member inserted into the first channel, and a second member inserted into the second channel, for allowing and restricting introduction and discharge of air into and from the inner space of the housing.

公开(公告)号：US10528006B2

公开(公告)日：2020-01-07

申请号：US16139362

申请日：2018-09-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Eun Park ,  Jeong-Eun Kim ,  Chang-Seok Bae

IPC: G04B37/08 ,  G04B37/14 ,  G04G17/08 ,  G06F1/16 ,  G04G17/06 ,  A44C5/14 ,  G04G21/02 ,  G04G21/04

Abstract: A wearable electronic device may include: a housing including a front plate, a rear plate, and a side member surrounding an inner space between the front plate and the rear plate, wherein the side member includes at least one portion including an external opening and an inner channel connecting between the inner space and the external opening: an insulating structure inserted into the inner channel; a conductive path partially embedded in the insulating structure, wherein the conductive path includes a first end exposed to the inner space and a second end exposed to the external opening; at least one printed circuit board positioned in the inner space and electrically connected to the first end of the conductive path; a display exposed through the front plate; and a band structure connected to the portion of the housing and configured to be mounted on a portion of a human body. The band structure may include a conductive rod movably inserted into the external opening and electrically connected to the second end of the conductive path, and an electronic component at least partially embedded in the band structure and electrically connected to the conductive rod. Other various embodiments may also exist.

公开(公告)号：US09999149B2

公开(公告)日：2018-06-12

申请号：US15442448

申请日：2017-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Soo Jun ,  Sung-Eun Park ,  Chang-Ok Lim ,  Min-Woo Yoo

IPC: G06K9/00 ,  H05K5/06 ,  H05K5/02 ,  H04R1/02

CPC classification number: H05K5/069 ,  H04M1/035 ,  H04M1/18 ,  H04R1/02 ,  H04R1/2853 ,  H04R2499/11 ,  H05K5/0217

Abstract: An electronic device is provided. The electronic device includes a housing including a first surface facing in a first direction, a second surface facing in a second direction opposite to the first direction, and a side surface surrounding at least a part of a space between the first surface and the second surface, an opening formed on at least one of the first surface, the second surface, or the side surface, a first channel extended from the opening, a second channel connected to at least a part of the first channel and extended to an inner space of the housing, an audio mounted inside the housing and connected to the opening through the first channel, a first member inserted into the first channel, and a second member inserted into the second channel, for allowing and restricting introduction and discharge of air into and from the inner space of the housing.

公开(公告)号：US20140029590A1

公开(公告)日：2014-01-30

申请号：US14042460

申请日：2013-09-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Eun Park ,  Jae-Weon Cho ,  Seung-Hoon Choi ,  Chi-Woo Lim ,  Song-Nam Hong

IPC: H04W56/00

CPC classification number: H04W56/0015 ,  H04L5/0007 ,  H04L5/0053 ,  H04L27/2613 ,  H04L27/2614 ,  H04L27/2626 ,  H04L27/2655

Abstract: A Synchronization Channel (SCH) transmission method includes generating a Primary SCH (P-SCH) sequence according to supplementary information. The supplementary information includes at least one of Base Station (BS) type information, Fast Fourier Transform (FFT) size information, BandWidth (BW) information, group information, sector information, and carrier type information. The method also includes modulating the P-SCH sequence and mapping the modulated P-SCH sequence to subcarriers within a predefined subcarrier set. The subcarriers are included in the subcarrier set being spaced one subcarrier interval apart. The method further includes generating a P-SCH symbol by Orthogonal Frequency Division Multiplexing (OFDM)-modulating the P-SCH sequence mapped to the subcarriers, and transmitting the P-SCH symbol.

Abstract translation: 同步信道（SCH）发送方法包括根据补充信息生成主SCH（P-SCH）序列。 补充信息包括基站（BS）类型信息，快速傅里叶变换（FFT）大小信息，带宽（BW）信息，组信息，扇区信息和载波类型信息中的至少一个。 该方法还包括调制P-SCH序列并将调制的P-SCH序列映射到预定子载波集内的子载波。 子载波被包括在间隔一个子载波间隔的子载波集合中。 该方法还包括通过正交频分复用（OFDM）生成P-SCH符号，调制映射到子载波的P-SCH序列，并发送P-SCH符号。

公开(公告)号：US10698367B2

公开(公告)日：2020-06-30

申请号：US16115683

申请日：2018-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Eun Park ,  Jong-Chun Wee ,  Wook-Jin Lee ,  Jae-Uk Ahn

IPC: H05K5/06 ,  G04B37/08 ,  G04G17/02 ,  H04R1/44 ,  G04G17/08 ,  G04G17/04 ,  G04G13/00 ,  H04R1/02 ,  H04R1/10

Abstract: An electronic device is disclosed including a housing including an outer wall, an inner, and a first through hole formed in the inner space, an audio module located in the inner space, a support structure located in the inner space between the audio module and the first through hole and including a second through hole; and a waterproof structure located in the inner space between the support structure and the outer wall including a flexible gasket. The gasket may include an outer rim, a recess portion moveable between the first through hole and the second through hole, and a connection portion between the rim and the recess portion, including at least one opening around the recess portion, such that the opening and the second through-hole form a sound path between the audio module and the first through-hole in the absence of pressure from an external liquid.

公开(公告)号：US20180110148A9

公开(公告)日：2018-04-19

申请号：US15442448

申请日：2017-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Soo Jun ,  Sung-Eun Park ,  Chang-Ok Lim ,  Min-Woo Yoo

IPC: H05K5/06 ,  H05K5/02 ,  H04R1/02

CPC classification number: H05K5/069 ,  H04M1/035 ,  H04M1/18 ,  H04R1/02 ,  H04R1/2853 ,  H04R2499/11 ,  H05K5/0217

Abstract: An electronic device is provided. The electronic device includes a housing including a first surface facing in a first direction, a second surface facing in a second direction opposite to the first direction, and a side surface surrounding at least a part of a space between the first surface and the second surface, an opening formed on at least one of the first surface, the second surface, or the side surface, a first channel extended from the opening, a second channel connected to at least a part of the first channel and extended to an inner space of the housing, an audio mounted inside the housing and connected to the opening through the first channel, a first member inserted into the first channel, and a second member inserted into the second channel, for allowing and restricting introduction and discharge of air into and from the inner space of the housing.

公开(公告)号：US09319068B2

公开(公告)日：2016-04-19

申请号：US14256288

申请日：2014-04-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyu-Bum Kyung ,  Hong-Sil Jeong ,  Jae-Yoel Kim ,  Sung-Eun Park ,  Kyeong-Cheol Yang ,  Se-Ho Myung

IPC: H03M13/00 ,  H03M13/11

CPC classification number: H03M13/1105 ,  H03M13/1102 ,  H03M13/1151 ,  H03M13/1162 ,  H03M13/1171 ,  H03M13/118 ,  H03M13/1185 ,  H03M13/1188 ,  H03M13/1194

Abstract: A system and method for processing a block Low Density Parity Check (LDPC) code are provided. The system includes, a decoding apparatus for decoding a block LDPC code using a parity check matrix, the parity check matrix including an information part and a parity part, the parity part including a first section (B) including a plurality of first permutation matrices, a second section (D) including a second permutation matrix, a third section (T) including a plurality of identity matrices (I) arranged diagonally within the third section and a plurality of third permutation matrices arranged below the plurality of identity matrices, and a fourth section (E) including a fourth permutation matrix.

Abstract translation: 提供了一种用于处理块低密度奇偶校验（LDPC）码的系统和方法。 该系统包括：使用奇偶校验矩阵解码块LDPC码的解码装置，奇偶校验矩阵包括信息部分和奇偶校验部分，奇偶校验部分包括包括多个第一置换矩阵的第一部分（B） 包括第二置换矩阵的第二部分（D），包括在第三部分内对角排列的多个单位矩阵（I）的第三部分（T）和布置在多个单位矩阵之下的多个第三置换矩阵，以及 第四部分（E）包括第四置换矩阵。

公开(公告)号：US09277516B2

公开(公告)日：2016-03-01

申请号：US14042460

申请日：2013-09-30

Applicant: Samsung Electronics Co., Ltd

Inventor： Sung-Eun Park ,  Jae-Weon Cho ,  Seung-Hoon Choi ,  Chi-Woo Lim ,  Song-Nam Hong

IPC: H04J3/00 ,  H04W56/00 ,  H04L5/00 ,  H04L27/26

CPC classification number: H04W56/0015 ,  H04L5/0007 ,  H04L5/0053 ,  H04L27/2613 ,  H04L27/2614 ,  H04L27/2626 ,  H04L27/2655

Abstract: A Synchronization Channel (SCH) transmission method includes generating a Primary SCH (P-SCH) sequence according to supplementary information. The supplementary information includes at least one of Base Station (BS) type information, Fast Fourier Transform (FFT) size information, BandWidth (BW) information, group information, sector information, and carrier type information. The method also includes modulating the P-SCH sequence and mapping the modulated P-SCH sequence to subcarriers within a predefined subcarrier set. The subcarriers are included in the subcarrier set being spaced one subcarrier interval apart. The method further includes generating a P-SCH symbol by Orthogonal Frequency Division Multiplexing (OFDM)-modulating the P-SCH sequence mapped to the subcarriers, and transmitting the P-SCH symbol.