公开(公告)号：US20180175016A1

公开(公告)日：2018-06-21

申请号：US15830988

申请日：2017-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae Sun Kim ,  Hyun Jae Kang ,  Tae Hoi Park ,  Jin Seong Lee ,  Eun Sol Choi ,  Min Keun Kwak ,  Byung Kap Kim ,  Sung Won Choi

IPC: H01L27/02 ,  H01L23/528 ,  H01L23/522 ,  G06F17/50

Abstract: A semiconductor device includes a first overlay group and a second overlay group disposed on a semiconductor substrate. The first overlay group includes first lower overlay patterns which extend in a first direction, first upper overlay patterns overlapping the first lower overlay patterns, and first via overlay patterns interposed between the first lower overlay patterns and the first upper overlay patterns. The second overlay group includes second lower overlay patterns which extend in a second direction, second upper overlay patterns overlapping the second lower overlay patterns, and second via overlay patterns interposed between the second lower overlay patterns and the second upper overlay patterns. The second lower overlay patterns include end portions adjacent to and spaced apart from the first overlay group.

公开(公告)号：US10573633B2

公开(公告)日：2020-02-25

申请号：US15830988

申请日：2017-12-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Sun Kim ,  Hyun Jae Kang ,  Tae Hoi Park ,  Jin Seong Lee ,  Eun Sol Choi ,  Min Keun Kwak ,  Byung Kap Kim ,  Sung Won Choi

IPC: H01L23/48 ,  H01L27/02 ,  G06F17/50 ,  H01L23/522 ,  H01L23/528 ,  G03F7/20 ,  H01L23/544

Abstract: A semiconductor device includes a first overlay group and a second overlay group disposed on a semiconductor substrate. The first overlay group includes first lower overlay patterns which extend in a first direction, first upper overlay patterns overlapping the first lower overlay patterns, and first via overlay patterns interposed between the first lower overlay patterns and the first upper overlay patterns. The second overlay group includes second lower overlay patterns which extend in a second direction, second upper overlay patterns overlapping the second lower overlay patterns, and second via overlay patterns interposed between the second lower overlay patterns and the second upper overlay patterns. The second lower overlay patterns include end portions adjacent to and spaced apart from the first overlay group.

公开(公告)号：US09649791B2

公开(公告)日：2017-05-16

申请号：US14251789

申请日：2014-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Woo Hong ,  Woo-Jin Bae ,  Chan Jae Ahn ,  Won Suk Chang ,  A ra Jo ,  Sung Won Choi

IPC: B29C41/46 ,  C08G73/14 ,  B29D11/00 ,  B29C41/00 ,  C08L79/08 ,  B29C39/00 ,  C09D179/08 ,  C08G73/10 ,  B29K79/00

CPC classification number: B29C41/46 ,  B29C39/003 ,  B29C41/003 ,  B29D11/00788 ,  B29K2079/08 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1067 ,  C08G73/14 ,  C08L79/08 ,  C09D179/08 ,  G02B1/041 ,  C08L33/24

Abstract: A method of preparing an optical film, preparing a coating composition including an amic acid-containing polymer represented by Chemical Formula 1 and at least one polymerization aid selected from an alkyl phosphite, an aryl phosphite, an alkyl phosphate, and an aryl phosphate; providing the coating composition on a substrate to form a coating layer; and applying heat to the coating layer to prepare a cured film: wherein, in Chemical Formula 1, are the same or different in each repeating unit, and are each independently at least one selected from an aromatic organic group, an aliphatic organic group, and an alicyclic organic group, and 0≦x≦1.

公开(公告)号：US09434098B2

公开(公告)日：2016-09-06

申请号：US14571475

申请日：2014-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Won Choi ,  Jae Wook Nam ,  Byung Hee Sohn ,  Sun Jin Song ,  Chan Jae Ahn ,  Semi Lee ,  Sung Woo Hong

IPC: B29C47/14 ,  B29C47/92 ,  B29L7/00 ,  B29C47/00

CPC classification number: B29C47/14 ,  B29C47/0021 ,  B29C47/92 ,  B29C2947/926 ,  B29C2947/92904 ,  B29L2007/008

Abstract: A slot die includes a material distribution chamber configured to distribute a casting solution supplied to the material distribution chamber, and a lip in which a slot including an expansion portion is defined and through which the casting solution distributed in the material distribution chamber is discharged, where a width of the expansion portion taken in a first direction is expanded from one side of the expansion portion to a lip end facing the one side and the one side of the expansion portion is apart from the lip end by a predetermined length taken along a second direction which is perpendicular to the first direction and substantially parallel to a flow direction of the casting solution.

Abstract translation: 狭槽模具包括配置成分配供给到材料分配室的铸造溶液的材料分配室，以及限定了包括膨胀部的槽的唇部，分配在材料分配室内的铸造溶液通过该排出排出， 沿着第一方向截取的膨胀部分的宽度从膨胀部分的一侧膨胀到面向一侧的唇形端部，并且膨胀部分的一侧与唇缘端部沿第二方向分开预定长度 方向，其垂直于第一方向并且基本上平行于铸造溶液的流动方向。