公开(公告)号：US20210391254A1

公开(公告)日：2021-12-16

申请号：US17155126

申请日：2021-01-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wookyung You ,  Kyeongbeom Park ,  Sungbin Park ,  Suhyun Park ,  Jongmin Baek ,  Jangho Lee ,  Seonghun Lim ,  Deokyoung Jung ,  Kyuhee Han

IPC: H01L23/522 ,  H01L23/528

Abstract: A semiconductor device includes a first insulating layer disposed on a substrate, a first wiring disposed in the first insulating layer, a first insulating barrier layer disposed on the first insulating layer, an etch-stop layer disposed on the first insulating barrier layer and having an area smaller than an area of the first insulating barrier layer in a plan view, a resistive metal pattern disposed on the etch-stop layer, a second insulating barrier layer disposed on the resistive metal pattern, a second insulating layer covering the first and second insulating barrier layers, a second wiring disposed in the second insulating layer, and a first conductive via disposed between the resistive metal pattern and the second wiring to penetrate through the second insulating barrier layer and the second insulating layer and electrically connect the resistive metal pattern and the second wiring.

公开(公告)号：US10682671B2

公开(公告)日：2020-06-16

申请号：US14943189

申请日：2015-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Baehyung Kim ,  Kyuhong Kim ,  Suhyun Park

IPC: H04B1/02 ,  B06B1/02 ,  G01S15/89 ,  B06B1/06 ,  G01S7/52

Abstract: There are provided an ultrasonic imaging apparatus, an ultrasonic probe apparatus, a signal processing apparatus, and a method for controlling an ultrasonic imaging apparatus. The ultrasonic imaging apparatus may include at least one first ultrasound element installed in a first ultrasound element installation unit; at least one second ultrasound element installed in a second ultrasound element installation unit that is separate from the first ultrasound element installation unit and such that the second ultrasound element forms a gap with the first ultrasound element; and a processor configured to estimate one or two or more virtual ultrasound signals that correspond to the gap based on a first ultrasound signal output from the at least one first ultrasound element and a second ultrasound signal output from the at least one second ultrasound element.

公开(公告)号：US11646263B2

公开(公告)日：2023-05-09

申请号：US17155126

申请日：2021-01-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wookyung You ,  Kyeongbeom Park ,  Sungbin Park ,  Suhyun Park ,  Jongmin Baek ,  Jangho Lee ,  Seonghun Lim ,  Deokyoung Jung ,  Kyuhee Han

IPC: H01L21/00 ,  H01L23/522 ,  H01L23/528

CPC classification number: H01L23/5226 ,  H01L23/528 ,  H01L23/5228

Abstract: A semiconductor device includes a first insulating layer disposed on a substrate, a first wiring disposed in the first insulating layer, a first insulating barrier layer disposed on the first insulating layer, an etch-stop layer disposed on the first insulating barrier layer and having an area smaller than an area of the first insulating barrier layer in a plan view, a resistive metal pattern disposed on the etch-stop layer, a second insulating barrier layer disposed on the resistive metal pattern, a second insulating layer covering the first and second insulating barrier layers, a second wiring disposed in the second insulating layer, and a first conductive via disposed between the resistive metal pattern and the second wiring to penetrate through the second insulating barrier layer and the second insulating layer and electrically connect the resistive metal pattern and the second wiring.

公开(公告)号：US10591597B2

公开(公告)日：2020-03-17

申请号：US14632614

申请日：2015-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyuhong Kim ,  Youngihn Kho ,  Baehyung Kim ,  Suhyun Park ,  Jongkeun Song

IPC: G01S7/52 ,  G01S15/89 ,  A61B8/00 ,  A61B8/08

Abstract: An ultrasound imaging apparatus includes an ultrasonic probe configured to transmit an ultrasound to an object, receive an echo signal reflected from the object, and output the echo signal; a quality determiner configured to receive the echo signals and determine quality of voxels of a three-dimensional (3D) volume of the object to be rendered based on observation information of the 3D volume; and a beamformer configured to perform beamforming on the echo signal based on the quality of the voxels to generate an output signal.

公开(公告)号：US10054677B2

公开(公告)日：2018-08-21

申请号：US14740535

申请日：2015-06-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyuhong Kim ,  Baehyung Kim ,  Suhyun Park ,  Jong Keun Song ,  Kyungil Cho

IPC: G01S7/52 ,  G10K11/34

CPC classification number: G01S7/52023 ,  G01S7/52025 ,  G01S7/52047 ,  G01S7/5208 ,  G10K11/346

Abstract: A beamforming apparatus includes: a signal output unit configured to output signals; a time difference corrector configured to correct a time difference between the signals; and a weight applier configured to apply a weight value to the signals, according to an error between the signals with the corrected time difference and a target delay pattern.