MEMORY DEVICE
    1.
    发明申请
    MEMORY DEVICE 审中-公开

    公开(公告)号:US20200091189A1

    公开(公告)日:2020-03-19

    申请号:US16692385

    申请日:2019-11-22

    Abstract: A memory device includes a plurality of gate electrode layers stacked on a substrate, a plurality of channel layers penetrating the plurality of gate electrode layers, a gate insulating layer between the plurality of gate electrode layers and the plurality of channel layers, and a common source line on the substrate adjacent to the gate electrode layers. The common source line includes a first part and a second part that are alternately arranged in a first direction and have different heights in a direction vertical to a top surface of the substrate. The gate insulating layer includes a plurality of vertical parts and a horizontal part. The plurality of vertical parts surrounds corresponding ones of the plurality of channel layers. The horizontal part extends parallel to a top surface of the substrate.

    Memory device
    2.
    发明授权

    公开(公告)号:US10522562B2

    公开(公告)日:2019-12-31

    申请号:US16149249

    申请日:2018-10-02

    Abstract: A memory device includes a plurality of gate electrode layers stacked on a substrate, a plurality of channel layers penetrating the plurality of gate electrode layers, a gate insulating layer between the plurality of gate electrode layers and the plurality of channel layers, and a common source line on the substrate adjacent to the gate electrode layers. The common source line includes a first part and a second part that are alternately arranged in a first direction and have different heights in a direction vertical to a top surface of the substrate. The gate insulating layer includes a plurality of vertical parts and a horizontal part. The plurality of vertical parts surrounds corresponding ones of the plurality of channel layers. The horizontal part extends parallel to a top surface of the substrate.

    Semiconductor memory device
    3.
    发明授权

    公开(公告)号:US11631692B2

    公开(公告)日:2023-04-18

    申请号:US16935306

    申请日:2020-07-22

    Abstract: A semiconductor memory device includes a peripheral logic structure including peripheral circuits on a substrate, a horizontal semiconductor layer extending along a top surface of the peripheral logic structure, a plurality of stack structures arranged on the horizontal semiconductor layer along a first direction, and a plurality of electrode separation regions in each of the plurality of stack structures to extend in a second direction, which is different from the first direction, wherein each of the plurality of stack structures includes a first electrode pad and a second electrode pad on the first electrode pad, the first electrode pad protruding in the first direction beyond the second electrode pad by a first width, and the first electrode pad protrudes in the second direction beyond the second electrode pad by a second width, which is different from the first width.

    Memory device
    4.
    发明授权

    公开(公告)号:US11004865B2

    公开(公告)日:2021-05-11

    申请号:US16692385

    申请日:2019-11-22

    Abstract: A memory device includes a plurality of gate electrode layers stacked on a substrate, a plurality of channel layers penetrating the plurality of gate electrode layers, a gate insulating layer between the plurality of gate electrode layers and the plurality of channel layers, and a common source line on the substrate adjacent to the gate electrode layers. The common source line includes a first part and a second part that are alternately arranged in a first direction and have different heights in a direction vertical to a top surface of the substrate. The gate insulating layer includes a plurality of vertical parts and a horizontal part. The plurality of vertical parts surrounds corresponding ones of the plurality of channel layers. The horizontal part extends parallel to a top surface of the substrate.

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