公开(公告)号：US12185534B2

公开(公告)日：2024-12-31

申请号：US17649562

申请日：2022-02-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junhyoung Kim ,  Byunggon Park ,  Seungmin Lee ,  Kangmin Kim ,  Taemin Eom ,  Byungkwan You

IPC: H10B41/40 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H01L23/538 ,  H01L23/60 ,  H01L27/02 ,  H10B41/10 ,  H10B41/27 ,  H10B41/35 ,  H10B41/50 ,  H10B43/10 ,  H10B43/27 ,  H10B43/35 ,  H10B43/40 ,  H10B43/50

Abstract: An integrated circuit device includes a substrate, a peripheral wiring circuit that includes a bypass via and is disposed on the substrate, a peripheral circuit that includes an interlayer insulating layer surrounding at least a portion of the peripheral wiring circuit, and a memory cell array disposed on and overlapping the peripheral circuit. The memory cell array includes a base substrate, a plurality of gate lines disposed on the base substrate, and a plurality of channels penetrating the plurality of gate lines. The integrated circuit device further includes a barrier layer interposed between the peripheral circuit and the memory cell array. The barrier layer includes a bypass hole penetrating from a top surface to a lower surface of the barrier layer. The bypass via is disposed in the bypass hole.

公开(公告)号：US20240389365A1

公开(公告)日：2024-11-21

申请号：US18786162

申请日：2024-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungmin Lee ,  Junhyoung Kim ,  Youngbum Woo ,  Joonsung Lim

IPC: H10B80/00 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H10B41/27 ,  H10B43/27

Abstract: A semiconductor device includes a first semiconductor structure including a first substrate, circuit devices disposed on the first substrate, and first metal bonding layers disposed on the circuit devices, and a second semiconductor structure including gate electrodes spaced apart from each other and stacked in a first direction, perpendicular to upper surfaces of the first metal bonding layers, channel structures passing through the gate electrodes, extending in the first direction, and respectively including a channel layer, second metal bonding layers disposed below the channel structures and the gate electrodes and connected to the first metal bonding layers, bit lines disposed below the channel structures, extending in a second direction, perpendicular to the first direction, and spaced apart from each other, and source lines disposed on the channel structures, extending in a third direction, perpendicular to the second direction, and spaced apart from each other. The channel structures are respectively disposed in intersection regions in which the bit lines and the source lines intersect each other.

公开(公告)号：US20230077532A1

公开(公告)日：2023-03-16

申请号：US17946761

申请日：2022-09-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wookyu KIM ,  Changbeom Kim ,  Taejun Yoo ,  Seungmin Lee

IPC: G06F30/392 ,  G06F30/394 ,  G06F30/327

Abstract: A standard cell and an integrated circuit including the same are is provided. The standard cell is provided in first and second rows. The standard cell includes: a first circuit region provided in the first row and including a plurality of first transistors; a second circuit region provided in the second row and including a plurality of second transistors; a first input pin provided in the first circuit region and configured to receive a first input signal; and a second input pin provided in the second circuit region and configured to receive a second input signal. The first input signal is input to gate terminals of each of the plurality of first transistors, and the second input signal is input to gate terminals of each of the plurality of second transistors. The first circuit region is symmetric with respect to a second horizontal direction and the second circuit region is symmetric with respect to the second horizontal direction.

公开(公告)号：US20230005949A1

公开(公告)日：2023-01-05

申请号：US17720453

申请日：2022-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungmin Lee ,  Kangmin Kim ,  Junhyoung Kim ,  Yonghoon Son ,  Joonsung Lim

IPC: H01L27/11575 ,  H01L23/535 ,  H01L49/02 ,  H01L27/11582 ,  H01L27/11573

Abstract: A semiconductor device includes a first structure including a peripheral circuit and a second structure on the first structure. The second structure includes: a stack structure including first and second stack structures; separation structures passing through the first stack structure; a memory vertical structure between the separation structures and passing through the first stack structure; and a capacitor including first and second capacitor electrodes passing through the second stack structure and extending parallel to each other. The first stack structure includes spaced apart gate electrodes and interlayer insulating layers alternately stacked therewith. The second stack structure includes spaced apart first insulating layers, and second insulating layers alternately stacked therewith. Each of the first and second capacitor electrodes has a linear shape. The first and second insulating layers include a different material from each other. The second insulating layers include the same material as the interlayer insulating layers.

公开(公告)号：US11329187B2

公开(公告)日：2022-05-10

申请号：US16883363

申请日：2020-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Kyungwook Hwang ,  Jungel Ryu ,  Sungjin Kang ,  Jongmyeong Kim ,  Jehong Oh ,  Euijoon Yoon ,  Seungmin Lee ,  Junsik Hwang

IPC: H01L33/00 ,  H01L27/15

Abstract: A method of aligning micro LEDs and a method of manufacturing a micro LED display using the same are provided. The method of aligning micro LEDs includes providing micro LEDs, each having a first surface that has a first maximum width and a second surface opposite to the first surface and has a second maximum width that is greater than the first maximum width, providing a transfer substrate including a transfer mold that has an array of openings, each of the openings being configured to accommodate the first surface of a corresponding micro LED and not accommodate the second surface of the corresponding micro LED and aligning the micro LEDs in one direction in the openings of the transfer mold by inserting the micro LEDs into the openings of the transfer mold so that the first surface of each of the micro LEDs is positioned within a corresponding opening.

公开(公告)号：USD796355S1

公开(公告)日：2017-09-05

申请号：US29555238

申请日：2016-02-19

Applicant: Samsung Electronics Co., Ltd.

Designer： Chul-Ho Cho ,  Myeong Su Cheon ,  Sangkyu Kim ,  Seungmin Lee

公开(公告)号：US12237439B2

公开(公告)日：2025-02-25

申请号：US17238163

申请日：2021-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Euijoon Yoon ,  Jongmyeong Kim ,  Jehong Oh ,  Seungmin Lee ,  Jungel Ryu

IPC: H01L33/18 ,  H01L25/075 ,  H01L33/24 ,  H01L33/32 ,  H01L33/62

Abstract: A display device with improved light-emitting efficiency is disclosed. The display device includes a plurality of pixels, a light emitting device provided in each of the pixels, the light emitting device having first and second surfaces which are opposite to each other, first and second electrodes electrically and respectively connected to the first and second surfaces of the light emitting device, and a metal oxide pattern interposed between the second surface of the light emitting device and the second electrode. The metal oxide pattern includes first and second regions. The first region encloses the second region, and the second region has a contact hole exposing at least a portion of the second surface. The second electrode is coupled to the second surface through the contact hole, and the first and second regions have crystalline phases different from each other.

公开(公告)号：US12196482B2

公开(公告)日：2025-01-14

申请号：US17860324

申请日：2022-07-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungmin Lee ,  Jehun Kang ,  Joongho Kim ,  Sungun Go

IPC: F25D23/06

Abstract: A refrigerator includes: an inner case including a plurality of plates formed by injection-molding; an outer case couplable with an exterior of the inner case; and an insulation between the inner case and the outer case. A first plate of the plurality of plates includes a first coupling portion formed along an edge of the first plate, and a second plate of the plurality of plates includes a second coupling portion formed along an edge of the second plate and couplable with the first coupling portion. The first coupling portion includes an insertion protrusion. The second coupling portion includes: an accommodating portion forming an accommodating groove in which the insertion protrusion is inserted; and a catching portion configured to prevent the insertion protrusion from departing from the accommodating groove; and an inner rib protruding from an inner surface of the accommodating portion to be inserted in the insertion groove.

公开(公告)号：US20240411227A1

公开(公告)日：2024-12-12

申请号：US18427044

申请日：2024-01-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Gap Im ,  Seonkyu Shin ,  Sanghoon Ahn ,  Hanhum Park ,  Minkyung Cho ,  Chungryeol Lee ,  Seungmin Lee ,  Changhyeon Lee ,  Sukwon Jang

IPC: G03F7/11 ,  G03F7/031 ,  G03F7/16 ,  H01L21/027 ,  H01L21/308

Abstract: A photolithograph method is provided. The photolithograph method may include forming a photoresist pattern on a substrate and conformally forming a liner layer on the photoresist pattern, wherein the forming of the liner layer includes a deposition process of reacting an initiator and a monomer with each other, the monomer includes multiple bonds between carbon atoms, the initiator includes a material that forms a radical by thermal decomposition, a copolymer is formed by an initiating reaction between the radical and the monomer, and the liner layer includes the copolymer.

公开(公告)号：US12034997B2

公开(公告)日：2024-07-09

申请号：US17680568

申请日：2022-02-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeki Kyoun ,  Heejin Ko ,  Hyunjee Kwak ,  Sunyoung Kim ,  Seungmin Lee ,  Yoojin Choi ,  Jeonghye Choi

IPC: H04N21/431 ,  H04N21/422 ,  H04N21/443 ,  H04N21/81

CPC classification number: H04N21/4312 ,  H04N21/42202 ,  H04N21/4438 ,  H04N21/8173

Abstract: A display device includes a display configured to output a broadcast content or a content for an interior decoration function, a memory storing a first layout for surrounding the broadcast content and a second layout for surrounding the content for the interior decoration function, and a processor operatively connected to the display and the memory, wherein the processor removes the first layout, enlarges the broadcast content, and outputs the enlarged broadcast content through the display based on a first user input, and enlarges portions of the content for the interior decoration function and of the second layout and outputs the enlarged portions of the content for the interior decoration function and of the second layout through the display based on a second user input.