公开(公告)号：US11829557B2

公开(公告)日：2023-11-28

申请号：US17893669

申请日：2022-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungheon Lee ,  Jeonghun Kim ,  Keehyon Park

IPC: G06F3/041 ,  G06F3/0488

CPC classification number: G06F3/0418 ,  G06F3/0488 ,  G06F2203/04105

Abstract: An electronic device and a method of operating the same are provided. The electronic device includes a touch screen, and at least one processor configured to determine, as any one of a first touch type or a second touch type, a type of a user input inputted on the touch screen, output a user interface (UI) corresponding to the first touch type based on the type of inputted touch being determined as the first touch type, correct the determined type as the second touch type based on an error being determined to be present in determining the type of inputted touch as the first touch type, and output a UI corresponding to the second touch type.

公开(公告)号：US11521527B2

公开(公告)日：2022-12-06

申请号：US17045341

申请日：2019-04-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungchul An ,  Sangseol Lee ,  Seungheon Lee ,  Kwangtai Kim ,  Hyungsup Byeon ,  Jiwoong Oh

IPC: G09G3/00 ,  G01R31/54 ,  H01L23/528

Abstract: A display device according to various embodiments comprises: a pixel layer comprising a plurality of pixels and having one or more parts of an area of an outer line, on which the plurality of pixels are disposed, depressively formed; and a wiring layer disposed along the depressively-formed one or more parts of the outer line, and comprising detection wiring for detecting cracks on an area adjacent to the pixel layer, wherein the wiring layer can be disposed below the pixel layer. Other various embodiments are possible.

公开(公告)号：US11764119B2

公开(公告)日：2023-09-19

申请号：US17672939

申请日：2022-02-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungheon Lee ,  Jaekang Koh ,  Hyukwoo Kwon ,  Munjun Kim ,  Taejong Han

IPC: H01L23/29 ,  H01L21/02 ,  H01L23/31

CPC classification number: H01L23/291 ,  H01L21/0228 ,  H01L23/3185

Abstract: A method of manufacturing an integrated circuit device, the method including forming a plurality of target patterns on a substrate such that an opening is defined between two adjacent target patterns; forming a pyrolysis material layer on the substrate such that the pyrolysis material layer partially fills the opening and exposes an upper surface and a portion of a sidewall of the two adjacent target patterns; and forming a material layer on the exposed upper surface and the exposed portion of the sidewall of the two adjacent target patterns, wherein, during the forming of the material layer, the material layer does not remain on a resulting surface of the pyrolysis material layer.

公开(公告)号：US11264294B2

公开(公告)日：2022-03-01

申请号：US16919307

申请日：2020-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungheon Lee ,  Jaekang Koh ,  Hyukwoo Kwon ,  Munjun Kim ,  Taejong Han

IPC: H01L21/02 ,  H01L23/29 ,  H01L23/31

Abstract: A method of manufacturing an integrated circuit device, the method including forming a plurality of target patterns on a substrate such that an opening is defined between two adjacent target patterns; forming a pyrolysis material layer on the substrate such that the pyrolysis material layer partially fills the opening and exposes an upper surface and a portion of a sidewall of the two adjacent target patterns; and forming a material layer on the exposed upper surface and the exposed portion of the sidewall of the two adjacent target patterns, wherein, during the forming of the material layer, the material layer does not remain on a resulting surface of the pyrolysis material layer.

公开(公告)号：US20240136426A1

公开(公告)日：2024-04-25

申请号：US18481433

申请日：2023-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungheon Lee ,  Donghyun Roh ,  Jangho Lee

IPC: H01L29/66 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/06 ,  H01L29/423 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L29/66545 ,  H01L21/823437 ,  H01L21/823475 ,  H01L27/088 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/775 ,  H01L29/78696

Abstract: A method of manufacturing a semiconductor device, includes forming a mask layer on a semiconductor structure having a plurality of gate lines and a plurality of intergate insulating portions, forming an opening that exposes a cut region of the plurality of gate lines in the mask layer, forming a separation hole by removing a portion of a gate capping layer exposed by the opening, forming a pyrolysis material pattern in the separation hole, forming an etch stop layer on an upper surface of the mask layer and on a side wall portion of the separation hole from which the pyrolysis material pattern is removed, while the pyrolysis material pattern is decomposed and removed, and removing a portion of the gate electrode exposed by the separation hole using the etch stop layer.

公开(公告)号：US20240234542A9

公开(公告)日：2024-07-11

申请号：US18481433

申请日：2023-10-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungheon Lee ,  Donghyun Roh ,  Jangho Lee

IPC: H01L29/66 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/06 ,  H01L29/423 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L29/66545 ,  H01L21/823437 ,  H01L21/823475 ,  H01L27/088 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/775 ,  H01L29/78696

Abstract: A method of manufacturing a semiconductor device, includes forming a mask layer on a semiconductor structure having a plurality of gate lines and a plurality of intergate insulating portions, forming an opening that exposes a cut region of the plurality of gate lines in the mask layer, forming a separation hole by removing a portion of a gate capping layer exposed by the opening, forming a pyrolysis material pattern in the separation hole, forming an etch stop layer on an upper surface of the mask layer and on a side wall portion of the separation hole from which the pyrolysis material pattern is removed, while the pyrolysis material pattern is decomposed and removed, and removing a portion of the gate electrode exposed by the separation hole using the etch stop layer.

公开(公告)号：US11580889B2

公开(公告)日：2023-02-14

申请号：US17478335

申请日：2021-09-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungheon Lee ,  Sehoon Kim ,  Wonhee Choe ,  Hoyoung Jung

IPC: G09G3/00 ,  G09G5/373

Abstract: An electronic device is provided. The electronic device includes a deformable display panel, a sensor, a display driving circuit operatively coupled to the deformable display panel and the sensor, and comprising a graphical random access memory (GRAM), and a processor operatively coupled to the display driving circuit and the sensor, wherein the display driving circuit can be configured to, while the size of a displayable area of the deformable display panel is changed, store, in the GRAM, data for displaying an image of a first size received from the processor, receive, from the sensor, a signal for indicating that the size of the displayable area is a second size smaller than the first size, after the data is stored, and scan part of the data in response to the reception of the signal, thereby displaying an image of the second size through the deformable display panel.