Speaker apparatus
    1.
    发明授权

    公开(公告)号:US10129653B2

    公开(公告)日:2018-11-13

    申请号:US15068039

    申请日:2016-03-11

    Abstract: A speaker apparatus capable of operating in a large amplitude regime by minimizing magnetic loss, is provided. The speaker device includes a magnet configured to generate a magnetic flux, a pole piece configured to form a path of the magnetic flux generated by the magnet, a back plate provided at a lower end of the pole piece to support the magnet, and a plate provided to form a magnetic gap between the plate and the pole piece. Several plates may be provided so that the magnetic gap is expanded to enlarge amplitude of output sound.

    Package substrate and light emitting device package

    公开(公告)号:US09935086B2

    公开(公告)日:2018-04-03

    申请号:US15342200

    申请日:2016-11-03

    CPC classification number: H01L25/0753 H01L33/62 H01L2224/16225

    Abstract: Provided are a package substrate and a light emitting device package. The package substrate may include a base substrate having a plurality of mounting regions and a plurality of unit light emitting regions which include at least one of the plurality of mounting regions, a plurality of first circuit patterns disposed on the base substrate and connected to a plurality of light emitting devices in the plurality of mounting regions, a plurality of second circuit patterns connected to the plurality of unit light emitting regions, and a wire electrically connecting the plurality of second circuit patterns to the plurality of second circuit patterns, each of the plurality of second circuit patterns being connected to different unit light emitting regions, or electrically connecting the plurality of first circuit patterns to the plurality of second circuit patterns.

    TEST APPARATUS FOR LIGHT EMITTING DEVICES
    3.
    发明申请

    公开(公告)号:US20170234937A1

    公开(公告)日:2017-08-17

    申请号:US15234417

    申请日:2016-08-11

    CPC classification number: G01R31/44 G01J1/0223 G01J1/42 G01J2001/4252

    Abstract: A testing apparatus includes a plate unit including at least one chip mounting unit on which a light emitting diode (LED) to be tested is mounted. The chip mounting unit has a first region in which the LED is overlaid and a second region surrounding the first region. The first and second electrode pads are disposed in the first region and include respective extension portions extended toward the second region. A probe portion is configured to connect to the extension portions of the first and second electrode pads. A power control unit is configured to selectively apply test power to the LED through the probe portion. A light measuring unit is configured to measure light properties of light emitted by the LED.

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