公开(公告)号：US11848301B2

公开(公告)日：2023-12-19

申请号：US18128449

申请日：2023-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggu Lee ,  Sunghyup Kim ,  Byungjo Kim ,  Sanghoon Lee ,  Sukwon Lee ,  Sebin Choi

IPC: H01L23/00 ,  B29C65/30 ,  B29C65/00

CPC classification number: H01L24/75 ,  B29C65/30 ,  B29C66/8185 ,  H01L2224/75252 ,  H01L2224/75502 ,  H01L2224/75745 ,  H01L2224/75984

Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

公开(公告)号：US20240424457A1

公开(公告)日：2024-12-26

申请号：US18393917

申请日：2023-12-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong Kim ,  Sebin Choi ,  Myeongjun Gil ,  Sunghyup Kim ,  Sunjoo Lee ,  Cheol-Jae Lee ,  Donghwy Chin ,  Donghee Han

IPC: B01F25/314 ,  B01F23/10 ,  B01F25/31

Abstract: A gas mixing device may include a main conduit and a gas transferring device connected to the main conduit. The gas transferring device may include a distribution device surrounding the main conduit, a supplying conduit connected to the distribution device and defining a supplying path, and a plurality of connection conduits connecting the first distribution device to the main conduit. The distribution device may include inner and outer cylinders, which are sequentially provided to surround the main conduit and are sequentially spaced apart from the main conduit in a radial direction. A distribution space may be defined between the inner and outer cylinders, and the supplying conduit may be coupled to the outer cylinder, such that the supplying path is connected to the distribution space. The connection conduits may be spaced apart from each other in a circumferential direction.

公开(公告)号：US11626381B2

公开(公告)日：2023-04-11

申请号：US16837025

申请日：2020-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggu Lee ,  Sunghyup Kim ,  Byungjo Kim ,  Sanghoon Lee ,  Sukwon Lee ,  Sebin Choi

IPC: H01L23/00 ,  B29C65/30 ,  B29C65/00

Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

公开(公告)号：US11607741B2

公开(公告)日：2023-03-21

申请号：US16807466

申请日：2020-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sebin Choi ,  Sunghyup Kim ,  Sukwon Lee ,  Jonggu Lee

IPC: B23K1/00 ,  H01L23/00 ,  B23K101/40

Abstract: Provided a semiconductor chip bonding apparatus including a body, a heater disposed on a lower surface of the body, a collet disposed on a lower surface of the heater, and a head disposed on a lower surface of the collet, the head has a rectangular plate shape, a lower surface and side surfaces of the head are exposed, an upper surface of the head is in contact with the lower surface of the collet, an area of the upper surface of the head is smaller than an area of the lower surface of the collet, the head includes a central section including a recess, and an outer surface constituting a part of the side surfaces of the head, and a peripheral section connected to the recess and disposed on each corners of the head, and a thermal conductivity of the peripheral section is different from that of the central section.