公开(公告)号：US20240318314A1

公开(公告)日：2024-09-26

申请号：US18609067

申请日：2024-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonjoo KANG ,  Yunjae Lee ,  Junhyung Kim ,  Youngbok Lee ,  Sangchul Han ,  Minsung Kim ,  Inhwan Park ,  Sangyeon Oh

IPC: C23C16/458 ,  C23C16/46

CPC classification number: C23C16/4586 ,  C23C16/46

Abstract: A substrate support device includes a chuck plate, a shaft connected to a center lower end of the chuck plate, a heater unit provided inside the chuck plate, an electrode unit provided inside the chuck plate, and provided on the heater unit, a jumper unit provided inside the chuck plate, arranged between the electrode unit and the heater unit, and electrically connected to the electrode unit to supply power to the electrode unit, and a power control unit, wherein the electrode unit includes a center electrode and a first electrode arranged in a ring shape around the center electrode, wherein the jumper unit includes a first jumper connected to the first electrode and a center jumper connected to the center electrode, and wherein the first jumper includes a first connection jumper, and a first inclined jumper electrically connecting the first jumper.

公开(公告)号：US20240321619A1

公开(公告)日：2024-09-26

申请号：US18439492

申请日：2024-02-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yunjae Lee ,  Jun Hyung Kim ,  Sangyeon Oh ,  Jihyeong Lee ,  Yonjoo Kang ,  Youngil Kang ,  Minsung Kim ,  Inhwan Park

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67288 ,  H01L21/02271

Abstract: The present disclosure relates to substrate supporters and substrate processing apparatuses. An example substrate supporter includes an upper surface on which a substrate is loaded, a base, an outer dam extending along an edge of the base, a contact band connected with the outer dam, extending along the circumferential direction of the base, and onto which the substrate is loaded, and a first contact pattern disposed adjacent to the contact band and extending into an inside of the contact band, the first contact pattern extending along the circumferential direction of the base, where an area of the first contact pattern is larger than an area where the contact band overlaps with the substrate.

公开(公告)号：US11688623B2

公开(公告)日：2023-06-27

申请号：US16834132

申请日：2020-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Racine Elysia Auxter Nassau ,  Namil Koo ,  Suhwan Park ,  Taeheung Ahn ,  Sangyeon Oh

IPC: H01L21/683 ,  H01L21/687 ,  G01N21/95

CPC classification number: H01L21/6838 ,  G01N21/9501 ,  H01L21/68714

Abstract: A wafer inspection apparatus includes a support structure including a frame and vacuum chucks mounted thereon, each vacuum chuck having a support surface including a vacuum suction portion, the support structure configured to structurally support a wafer on one or more vacuum chucks, the frame defining an opening larger than an area of the wafer. The wafer inspection apparatus includes an electromagnetic wave emitter configured to irradiate an inspection electromagnetic wave to the wafer, a sensor configured to receive the inspection electromagnetic wave from the wafer based on the inspection electromagnetic wave passing through the wafer, and a driver configured to move at least one of the electromagnetic wave emitter or the frame to change an irradiation location of the wafer. Each vacuum chuck is configured to be selectively movable between a first location and a second location in relation to the frame.