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    Light emitting diode transfer system and control method thereof
    1.
    发明授权
    Light emitting diode transfer system and control method thereof 有权

    公开(公告)号：US11715811B2

    公开(公告)日：2023-08-01

    申请号：US17133171

    申请日：2020-12-23

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Doyoung Kwag ,  Byungchul Kim ,  Sangmoo Park ,  Minsub Oh ,  Wonsik Choi

    IPC: H01L33/00 ,  H01L25/075

    CPC classification number: H01L33/005 ,  H01L25/075 ,  H01L25/0753

    Abstract: A light emitting diode (LED) transfer system includes an alignment apparatus configured to align a plurality of target substrates; a handling robot configured to transport the plurality of target substrates; a transfer stage configured to hold the plurality of target substrates and move the plurality of target substrates; a substrate stage configured to move a relay substrate having a plurality of LEDs with respect to the transfer stage while the plurality of LEDs are facing the transfer stage; a laser configured to emit a laser beam toward the plurality of LEDs of the relay substrate so that the plurality of LEDs are transferred from the relay substrate to the plurality of target substrates; and a processor configured to control the alignment apparatus, the handling robot, the transfer stage, the substrate stage, and the laser to transfer the plurality of LEDs of the relay substrate to the plurality of target substrates.

    Laser transfer apparatus and transfer method using i he same
    6.
    发明授权
    Laser transfer apparatus and transfer method using i he same 有权

    公开(公告)号：US11348821B2

    公开(公告)日：2022-05-31

    申请号：US16929311

    申请日：2020-07-15

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Doyoung Kwag ,  Byungchul Kim ,  Sangmoo Park ,  Minsub Oh

    IPC: H01L21/683 ,  B23K26/03 ,  B23K26/04 ,  B23K26/08 ,  H01L21/67 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62

    Abstract: The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.

    Chip transfer device and chip transferring method using the same
    7.
    发明授权
    Chip transfer device and chip transferring method using the same 有权

    公开(公告)号：US11004705B2

    公开(公告)日：2021-05-11

    申请号：US16282581

    申请日：2019-02-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Doyoung Kwag ,  Sangmoo Park ,  Yoonsuk Lee

    IPC: H01L25/075 ,  H01L21/67 ,  H01L21/687 ,  H01L33/62

    Abstract: A chip transfer device is provided. The chip transfer device according to an embodiment includes a support, a plurality of pick-up modules disposed on the support in a horizontal direction, and movably connected to the support, and a controller configured to control the plurality of pick-up modules, wherein each of the plurality of pick-up modules is movable while collectively picking up a plurality of chips on a corresponding wafer among a plurality of wafers, and wherein the controller moves and adjusts the plurality of pick-up modules in a horizontal direction.

    DISPLAY PANEL AND METHOD OF MANUFACTURING THEREOF
    8.
    发明申请
    DISPLAY PANEL AND METHOD OF MANUFACTURING THEREOF 审中-公开

    公开(公告)号：US20200328196A1

    公开(公告)日：2020-10-15

    申请号：US16845485

    申请日：2020-04-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seungryong Han ,  Sangmoo Park ,  Hyunsun Kim

    IPC: H01L25/16 ,  H01L33/62 ,  H01L21/66

    Abstract: A display panel and a method of manufacturing thereof are provided. The method of manufacturing a display panel includes forming a driving circuit on a substrate; forming an electrode, including a first area and a second area therewith, on the driving circuit; mounting a first micro Light Emitting Diode (LED), for forming a sub pixel, on the first area; forming an absorption layer on the second area, the absorption layer configure to absorb an external light; removing, based on the sub pixel being defective, the absorption layer; and mounting a second micro LED on the second area after removing the absorption layer.

    Micro LED transfer device and micro LED transferring method using the same
    10.
    发明授权
    Micro LED transfer device and micro LED transferring method using the same 有权

    公开(公告)号：US11695092B2

    公开(公告)日：2023-07-04

    申请号：US17674520

    申请日：2022-02-17

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoonsuk Lee ,  Sangmoo Park ,  Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Minsub Oh ,  Dongyeob Lee

    IPC: H01L33/00 ,  H01L33/62

    CPC classification number: H01L33/0095 ,  H01L33/62

    Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

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