公开(公告)号：US20170029664A1

公开(公告)日：2017-02-02

申请号：US15214847

申请日：2016-07-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Ho PARK ,  Ki-Hwa JUNG ,  Sang-Kyun KIM ,  Jun-Ha HWANG ,  Chang-Gil KWON ,  Seung-Yeop BAEK ,  Jae-Woo LEE ,  Ji-Sung LEE ,  Jae-Kwang CHOI ,  Jin-Myung HWANG

IPC: C09G1/02 ,  H01L29/06 ,  H01L21/3105 ,  H01L21/762

CPC classification number: C09G1/02 ,  H01L21/31053 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/823821 ,  H01L29/0649 ,  H01L29/66795 ,  H01L29/785 ,  H01L29/7853

Abstract: A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer.

Abstract translation: 抛光组合物包括研磨颗粒，含有亲水基团的吡咯烷酮，分散剂，包含聚丙烯酸的第一凹陷抑制剂和包含非离子聚合物的第二凹陷抑制剂。

公开(公告)号：US20160137953A1

公开(公告)日：2016-05-19

申请号：US14942206

申请日：2015-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ahn-Ho LEE ,  Chung-Kyung JUNG ,  Dong-Min KANG ,  Dong-Hun KANG ,  Go-Un KIM ,  Dong-Jin KIM ,  Yong-Sik YOO ,  Young-Chul JUNG ,  Yu-Ri JUNG ,  Jung-Min CHOI ,  Sang-Kyun KIM

IPC: C11D1/00 ,  C11D3/30 ,  C11D11/00 ,  C11D3/20

CPC classification number: C11D1/008 ,  C11D1/662 ,  C11D1/667 ,  C11D1/72 ,  C11D3/2079 ,  C11D3/28 ,  C11D3/30 ,  C11D3/43 ,  C11D11/0047

Abstract: A cleaning composition includes an organic solvent, an organic acid, a chelating agent, a surfactant containing at least one hydroxyl group (OH) at the end, and an ultra pure water, wherein a pH value of the cleaning composition is equal to or higher than 12.

Abstract translation: 清洁组合物包括有机溶剂，有机酸，螯合剂，末端含有至少一个羟基（OH）的表面活性剂和超纯水，其中清洗组合物的pH值等于或等于 超过12。