公开(公告)号：US20170029664A1

公开(公告)日：2017-02-02

申请号：US15214847

申请日：2016-07-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Ho PARK ,  Ki-Hwa JUNG ,  Sang-Kyun KIM ,  Jun-Ha HWANG ,  Chang-Gil KWON ,  Seung-Yeop BAEK ,  Jae-Woo LEE ,  Ji-Sung LEE ,  Jae-Kwang CHOI ,  Jin-Myung HWANG

IPC: C09G1/02 ,  H01L29/06 ,  H01L21/3105 ,  H01L21/762

CPC classification number: C09G1/02 ,  H01L21/31053 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/823821 ,  H01L29/0649 ,  H01L29/66795 ,  H01L29/785 ,  H01L29/7853

Abstract: A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer.

Abstract translation: 抛光组合物包括研磨颗粒，含有亲水基团的吡咯烷酮，分散剂，包含聚丙烯酸的第一凹陷抑制剂和包含非离子聚合物的第二凹陷抑制剂。