公开(公告)号：US20160293230A1

公开(公告)日：2016-10-06

申请号：US15187320

申请日：2016-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Gyu Chu ,  Hyo Soon Kang ,  Seung Bum Ko ,  Sang Jae Rhee

IPC: G11C7/10 ,  H01L25/00 ,  H01L25/065 ,  G11C7/22

CPC classification number: G11C7/10 ,  G11C7/1012 ,  G11C7/1045 ,  G11C7/22 ,  G11C2207/105 ,  H01L21/50 ,  H01L23/48 ,  H01L23/50 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/06155 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2924/1434

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

公开(公告)号：US11604220B2

公开(公告)日：2023-03-14

申请号：US17517057

申请日：2021-11-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung Il Kim ,  Se-Hyun Seo ,  Byeong Min Yu ,  Jae Hong Kim ,  Sang Jae Rhee ,  Young Chyel Lee

IPC: G01R31/28 ,  G01R1/04

Abstract: A test apparatus includes a first module configured to structurally support a target semiconductor device, and a second module reversibly attachable to the first module. The first module includes a first housing including one or more inner surfaces at least partially defining an inner space, a volume control unit configured to control a volume of the inner space, a mounting unit at least partially exposed to the inner space and configured to be exposed to the target semiconductor device, and a magnetic force control unit in the first housing. The second module includes a second housing, a test board in the second housing, and an attachable/detachable member in the second housing. The test board may be electrically connected to the target semiconductor device. The magnetic force control unit may control a magnetic property of the attachable/detachable member to cause the attachable/detachable member to attach/detach to/from the magnetic force control unit.

公开(公告)号：US10403331B2

公开(公告)日：2019-09-03

申请号：US15187320

申请日：2016-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Gyu Chu ,  Hyo Soon Kang ,  Seung Bum Ko ,  Sang Jae Rhee

IPC: G11C7/10 ,  H01L21/50 ,  H01L23/48 ,  H01L23/50 ,  G11C7/22 ,  H01L25/065 ,  H01L25/00

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

公开(公告)号：US09390772B2

公开(公告)日：2016-07-12

申请号：US13833740

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Gyu Chu ,  Hyo Soon Kang ,  Seung Bum Ko ,  Sang Jae Rhee

IPC: G11C7/00 ,  G11C7/10 ,  H01L21/50 ,  H01L23/48 ,  H01L23/50

CPC classification number: G11C7/10 ,  G11C7/1012 ,  G11C7/1045 ,  G11C7/22 ,  G11C2207/105 ,  H01L21/50 ,  H01L23/48 ,  H01L23/50 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/06155 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2924/1434

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract translation: 半导体器件包括存储单元阵列，焊盘组，第一可选焊盘，第二可选焊盘和数据输入多路复用器块，其被配置为基于是否通过全部或部分焊盘组输入数据到存储器单元阵列 所述第一可选焊盘和接地彼此连接，其中所述数据输入多路复用器块被配置为基于所述焊盘组中的所述第二焊盘组或所述焊盘组中的第二焊盘组作为所述焊盘组的一部分来选择所述焊盘组中的第一焊盘组， 选项板和地面相互连接。