公开(公告)号：US20230197789A1

公开(公告)日：2023-06-22

申请号：US18169327

申请日：2023-02-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Kak Lee ,  Min Woo Kim ,  Bong Hyun Kim ,  Hee Young Park ,  Seo Jin Ahn ,  Won Yong Lee

IPC: H01L29/10 ,  H01L21/762 ,  H10B12/00

CPC classification number: H01L29/1083 ,  H01L21/76224 ,  H10B12/34 ,  H10B12/31

Abstract: A semiconductor device includes a trench defining an active region in a substrate, a first insulating layer on a bottom surface and side surfaces of the active region inside the trench, a shielding layer on a surface of the first insulating layer, the shielding layer including a plurality of spaced apart particles, a second insulating layer on the shielding layer and having first charge trapped therein, the plurality of spaced apart particles being configured to concentrate second charge having an opposite polarity to the charge trapped in the second insulating layer, and a gap-fill insulating layer on the second insulating layer in the trench.

公开(公告)号：US12072370B2

公开(公告)日：2024-08-27

申请号：US17406553

申请日：2021-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Ok Kim ,  Min Woo Kim ,  Ho Gyung Kim ,  Dahm Yu ,  Jae Hyun Kim

IPC: G01R31/27 ,  G01R31/28 ,  G01R31/3183

CPC classification number: G01R31/275 ,  G01R31/2862 ,  G01R31/2872 ,  G01R31/2889 ,  G01R31/318314

Abstract: A semiconductor package test apparatus is provided. A semiconductor package test apparatus comprises a test board including a plurality of sensors, a chamber into which the test board is loaded, and a controller configured to control a temperature of the chamber, wherein the controller adjusts the temperature using the plurality of sensors.

公开(公告)号：US11605714B2

公开(公告)日：2023-03-14

申请号：US16353750

申请日：2019-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Kak Lee ,  Min Woo Kim ,  Bong Hyun Kim ,  Hee Young Park ,  Seo Jin Ahn ,  Won Yong Lee

IPC: H01L29/40 ,  H01L29/10 ,  H01L21/762 ,  H01L27/108

Abstract: A semiconductor device includes a trench defining an active region in a substrate, a first insulating layer on a bottom surface and side surfaces of the active region inside the trench, a shielding layer on a surface of the first insulating layer, the shielding layer including a plurality of spaced apart particles, a second insulating layer on the shielding layer and having first charge trapped therein, the plurality of spaced apart particles being configured to concentrate second charge having an opposite polarity to the charge trapped in the second insulating layer, and a gap-fill insulating layer on the second insulating layer in the trench.

公开(公告)号：US11519953B2

公开(公告)日：2022-12-06

申请号：US16875065

申请日：2020-05-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Woo Kim ,  Seung Bin Ko ,  Dong Joo Roh ,  Chang Ho Lee ,  Jin-Ho Choi

IPC: G01R31/26 ,  G01R31/28 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073

Abstract: An apparatus for testing a semiconductor device is described. The apparatus includes a test chamber in which a test process for a plurality of semiconductor devices is performed, a first storage disposed in the test chamber with a first semiconductor device located therein, a second storage spaced apart in a first direction from the first storage with a second semiconductor device located therein, a first nozzle extending in the first direction on a first sides of the first and second storages and including a plurality of first air outlets configured to discharge air, a second nozzle extending in the first direction on and including a plurality of second air outlets configured to discharge air, and a controller controlling temperatures of the first and second semiconductor devices within a predefined temperature range by controlling the air discharged by the first and second nozzles.