公开(公告)号：US12072370B2

公开(公告)日：2024-08-27

申请号：US17406553

申请日：2021-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Ok Kim ,  Min Woo Kim ,  Ho Gyung Kim ,  Dahm Yu ,  Jae Hyun Kim

IPC: G01R31/27 ,  G01R31/28 ,  G01R31/3183

CPC classification number: G01R31/275 ,  G01R31/2862 ,  G01R31/2872 ,  G01R31/2889 ,  G01R31/318314

Abstract: A semiconductor package test apparatus is provided. A semiconductor package test apparatus comprises a test board including a plurality of sensors, a chamber into which the test board is loaded, and a controller configured to control a temperature of the chamber, wherein the controller adjusts the temperature using the plurality of sensors.