公开(公告)号：US20200075730A1

公开(公告)日：2020-03-05

申请号：US16353750

申请日：2019-03-14

Applicant: Samsung Electronics Co., Ltd

Inventor： Dong Kak Lee ,  Min Woo KIM ,  Bong Hyun KIM ,  Hee Young PARK ,  Seo Jin AHN ,  Won Yong LEE

IPC: H01L29/10 ,  H01L27/108 ,  H01L21/762

Abstract: A semiconductor device includes a trench defining an active region in a substrate, a first insulating layer on a bottom surface and side surfaces of the active region inside the trench, a shielding layer on a surface of the first insulating layer, the shielding layer including a plurality of spaced apart particles, a second insulating layer on the shielding layer and having first charge trapped therein, the plurality of spaced apart particles being configured to concentrate second charge having an opposite polarity to the charge trapped in the second insulating layer, and a gap-fill insulating layer on the second insulating layer in the trench.

公开(公告)号：US20220057444A1

公开(公告)日：2022-02-24

申请号：US17406553

申请日：2021-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Ok KIM ,  Min Woo KIM ,  Ho Gyung KIM ,  Dahm YU ,  Jae Hyun KIM

IPC: G01R31/27 ,  G01R31/28 ,  G01R31/3183

Abstract: A semiconductor package test apparatus is provided. A semiconductor package test apparatus comprises a test board including a plurality of sensors, a chamber into which the test board is loaded, and a controller configured to control a temperature of the chamber, wherein the controller adjusts the temperature using the plurality of sensors.