公开(公告)号：US20220057444A1

公开(公告)日：2022-02-24

申请号：US17406553

申请日：2021-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Ok KIM ,  Min Woo KIM ,  Ho Gyung KIM ,  Dahm YU ,  Jae Hyun KIM

IPC: G01R31/27 ,  G01R31/28 ,  G01R31/3183

Abstract: A semiconductor package test apparatus is provided. A semiconductor package test apparatus comprises a test board including a plurality of sensors, a chamber into which the test board is loaded, and a controller configured to control a temperature of the chamber, wherein the controller adjusts the temperature using the plurality of sensors.