公开(公告)号：US20250012854A1

公开(公告)日：2025-01-09

申请号：US18620170

申请日：2024-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihyun CHOI ,  Seonmi LEE ,  Yonggyun KIM ,  Seongseob SHIN ,  Dahm YU ,  Dongho LEE

IPC: G01R31/28

Abstract: A test device includes a test board, a connector attached to a lower surface of the test board, a heating device disposed on an upper surface of the test board, the heating device configured to emit heat in response to a signal input through the connector, a temperature sensor disposed on the upper surface of the test board, the temperature sensor configured to measure a temperature of the heating device, and a test socket disposed on the upper surface of the test board, the test socket configured to transmit and receive a signal to and from the heating device and the temperature sensor. Before a test process is performed or after the test process is completed, an internal temperature of a chamber may be verified, thereby improving reliability of the test process.

公开(公告)号：US20220057444A1

公开(公告)日：2022-02-24

申请号：US17406553

申请日：2021-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Ok KIM ,  Min Woo KIM ,  Ho Gyung KIM ,  Dahm YU ,  Jae Hyun KIM

IPC: G01R31/27 ,  G01R31/28 ,  G01R31/3183

Abstract: A semiconductor package test apparatus is provided. A semiconductor package test apparatus comprises a test board including a plurality of sensors, a chamber into which the test board is loaded, and a controller configured to control a temperature of the chamber, wherein the controller adjusts the temperature using the plurality of sensors.

公开(公告)号：US20200271715A1

公开(公告)日：2020-08-27

申请号：US16561741

申请日：2019-09-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seon-Mi LEE ,  Sung Jin KIM ,  Ja-Hwan KU ,  Jae-Hyun KIM ,  Gilho LEE ,  Dahm YU ,  Jonghyun LIM

IPC: G01R31/26

Abstract: Disclosed are a test chamber and a test apparatus having the same. The test chamber includes a test compartment configured to support a plurality of test boards, each being configured to secure a test object. The test chamber applies a test signal to the test object. The test chamber includes an inlet side and a discharge side, and a supply duct vertically extending along a height of the test compartment. The supply duct supplies the inlet side of the test compartment with the test fluid. The test chamber includes a fluid controller to uniformly control a distribution of a test fluid in the supply duct and uniformly supply the test compartment with the test fluid. The disclosed test chamber and test apparatus provide a uniform test temperature and thereby improve a test reliability of a test object such as a semiconductor or semiconductor package.