公开(公告)号：US20250012854A1

公开(公告)日：2025-01-09

申请号：US18620170

申请日：2024-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihyun CHOI ,  Seonmi LEE ,  Yonggyun KIM ,  Seongseob SHIN ,  Dahm YU ,  Dongho LEE

IPC: G01R31/28

Abstract: A test device includes a test board, a connector attached to a lower surface of the test board, a heating device disposed on an upper surface of the test board, the heating device configured to emit heat in response to a signal input through the connector, a temperature sensor disposed on the upper surface of the test board, the temperature sensor configured to measure a temperature of the heating device, and a test socket disposed on the upper surface of the test board, the test socket configured to transmit and receive a signal to and from the heating device and the temperature sensor. Before a test process is performed or after the test process is completed, an internal temperature of a chamber may be verified, thereby improving reliability of the test process.