公开(公告)号：US10424497B2

公开(公告)日：2019-09-24

申请号：US15628725

申请日：2017-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bum-Soo Kim ,  Philwoong Jung ,  Yoonmi Lee ,  Hangryong Lim ,  Manyoung Shin ,  Young Hoon Son

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/00

Abstract: A wafer carrier including a case having an opening at one end, slots disposed in the case and receiving wafers, and a wireless communication circuitry disposed on an inner sidewall of the case and configured to detect humidity of a gas contained in the case may be provided. The wireless communication circuitry may be further configured to compare the detected humidity with a threshold humidity predetermined, and transmit a first warning signal to an external host via wireless communication when the detected humidity is greater than the threshold humidity.

公开(公告)号：US09658949B2

公开(公告)日：2017-05-23

申请号：US14622185

申请日：2015-02-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Manyoung Shin ,  Janghyuk An

IPC: G06F11/00 ,  G06F11/36 ,  G06F11/263 ,  G01R31/28

CPC classification number: G06F11/3692 ,  G01R31/2868 ,  G06F11/24 ,  G06F11/263

Abstract: A test system method for testing software of each of a plurality of system on chips (SoCs) are provided. The test system includes: a plurality of test units configured to test the plurality of SoCs according to a plurality of test cases, respectively; a power supplier configured to supply, to each of the plurality of test units, power of a level corresponding to a corresponding test case, among the plurality of test cases; a temperature controller configured to provide, to each of the plurality of test units, a temperature control signal according to the corresponding test case, and to monitor a measurement temperature, provided from each of the plurality of test units, of each of the plurality of SoCs; and an analyzer configured to analyze at least one of a driving voltage, a driving current, and a driving frequency of each of the plurality of SoCs.