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1.
公开(公告)号:US20220165550A1
公开(公告)日:2022-05-26
申请号:US17397530
申请日:2021-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyoungchon Kim , Taemin Earmme , Kwangnam Kim , Jongwoo Sun
IPC: H01J37/32 , H01L21/683 , H01L21/3065
Abstract: A plasma processing apparatus includes a substrate chuck having a first region configured to support a substrate and a second region located at a lower level, a focus ring disposed on the second region and surrounding an outer circumferential surface of the first region, a driving unit disposed below the focus ring, the driving unit including a driving source and a driving shaft in contact with a lower surface of the focus ring and configured to adjust a position of an upper surface of the focus ring by a first distance value, a chromatic confocal sensor disposed below the focus ring and configured to measure a second distance value in which the lower surface of the focus ring is moved by irradiating measurement light to the lower surface of the focus ring, and a control unit calculating an error value between the first distance value and the second distance value.
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公开(公告)号:US10006872B2
公开(公告)日:2018-06-26
申请号:US14955331
申请日:2015-12-01
Applicant: Samsung Electronics Co., Ltd. , Samsung Display Co., Ltd.
Inventor: Wonguk Seo , Kyoungchon Kim , Kuihyun Yoon , Kyunlae Kim , Jaeyoung Park , Kyoungho Yang , Young Heo
IPC: G01N21/958 , G01N21/88 , G01N21/94 , G01N21/95
CPC classification number: G01N21/94 , G01N21/8806 , G01N21/958 , G01N2021/9513
Abstract: Provided is an optical inspection system including a supporting unit, allowing a target object to be loaded thereon, a light source unit configured to emit a laser beam toward the target object, a light condensing unit collecting scattered light that is scattered at the target object when the laser beam is irradiated onto the target object, and a control unit controlling the light source unit and the light condensing unit and analyzing the scattered light to examine whether there are pollutants on the target object. The supporting unit may include a first supporting unit, on which the target object is disposed, and which is formed of a first material, and a second supporting unit, which is disposed under the first supporting unit and is formed of a second material different from the first material.
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