公开(公告)号：US20190157279A1

公开(公告)日：2019-05-23

申请号：US16237913

申请日：2019-01-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngbeom PYON ,  Kichul PARK ,  Inkwon KIM ,  Ki Hoon JANG ,  Byoungho KWON ,  Sangkyun KIM ,  Boun YOON

IPC: H01L27/112 ,  H01L23/535 ,  H01L23/528 ,  H01L27/11582 ,  H01L27/11575 ,  H01L27/11573 ,  H01L27/1157 ,  H01L27/11565 ,  H01L27/11551 ,  H01L27/11578

CPC classification number: H01L27/11286 ,  H01L21/02107 ,  H01L21/76801 ,  H01L21/76819 ,  H01L23/528 ,  H01L23/535 ,  H01L23/538 ,  H01L27/112 ,  H01L27/11551 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11575 ,  H01L27/11578 ,  H01L27/11582

Abstract: A semiconductor device includes a substrate, a peripheral structure, a lower insulating layer, and a stack. The substrate includes a peripheral circuit region and a cell array region. The peripheral structure is on the peripheral circuit region. The lower insulating layer covers the peripheral circuit region and the cell array region and has a protruding portion protruding from a flat portion. The stack is on the lower insulating layer and the cell array region, and includes upper conductive patterns and insulating patterns which are alternately and repeatedly stacked.

公开(公告)号：US20230170296A1

公开(公告)日：2023-06-01

申请号：US17961056

申请日：2022-10-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Anthony Dongick LEE ,  Sangcheol NA ,  Kichul PARK ,  Doohwan PARK ,  Kyoungwoo LEE ,  Rakhwan KIM ,  Yoonsuk KIM ,  Jinnam KIM ,  Hoonjoo NA ,  Eunji JUNG ,  Juyoung JUNG

IPC: H01L23/522 ,  H01L23/532

CPC classification number: H01L23/5226 ,  H01L23/53238 ,  H01L23/53223 ,  H01L23/53266

Abstract: A semiconductor device includes a substrate. A wiring layer is over the substrate. A first via structure directly contacts a lower portion of the wiring layer. A second via structure directly contacts an upper portion of the wiring layer. The first via structure generates first stress in the wiring layer. The second via structure generates second stress in the wiring layer. The second stress is of an opposite type to the first stress. The first stress and the second stress compensate for each other in the wiring layer.

公开(公告)号：US20230065281A1

公开(公告)日：2023-03-02

申请号：US17751819

申请日：2022-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Anthony Dongick LEE ,  Sangcheol NA ,  Kichul PARK ,  Sungyup JUNG ,  Youngwoo CHO

IPC: H01L23/528 ,  H01L23/532 ,  H01L21/768

Abstract: A semiconductor device including a first insulating structure on a substrate and including a first etch stop layer and a first interlayer insulating layer on the first etch stop layer, a second insulating structure on the first insulating structure and including a second etch stop layer and a second interlayer insulating layer on the second etch stop layer, a conductive line penetrating through the second insulating structure, and extending in a first direction parallel to an upper surface of the substrate, and a plurality of contacts penetrating through the first insulating structure and connected to the conductive line may be provided. The conductive line may include a protrusion extending below the second insulating structure and penetrating through the first interlayer insulating layer to be in contact with the first etch stop layer.

公开(公告)号：US20220070248A1

公开(公告)日：2022-03-03

申请号：US17521594

申请日：2021-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungho JEON ,  Timothy John EBIDO ,  Kichul PARK

IPC: H04L29/08 ,  H04L29/06

Abstract: An electronic device includes a memory storing a first data set comprising a first plurality of files; a communicator comprising circuitry; and a processor configured to: identify an amount of files having a size less than a first threshold value among the first plurality of files; based on the identified amount of files and a communication state with a server, determine a size of a unit file to be transmitted to the server; convert the identified files having the size less than the first threshold value into the determined size unit, and generate metadata for the first data set while converting the identified files; and control the communicator to transmit the first data set including the converted files and the metadata for the first data set to the server.