WEARABLE DEVICE AND METHOD FOR PROVIDING WIDGET THEREOF

    公开(公告)号:US20190311401A1

    公开(公告)日:2019-10-10

    申请号:US16335943

    申请日:2017-09-08

    Abstract: A wearable device and a method for providing a widget thereof are provided. A method for providing a widget in a wearable device of the present disclosure comprises the steps of: sensing status information of a user; transmitting the status information of the user to an external server; selecting an application type to be provided from the external server according to a user command; receiving, from the external server, information on at least one application corresponding to the status information of the user on the basis of the selected application type and the status information of the user; and providing, on a screen, a widget corresponding to an application selected by the user among the at least one application.

    METHOD AND SYSTEM FOR EXECUTING AN APPLICATION
    4.
    发明申请
    METHOD AND SYSTEM FOR EXECUTING AN APPLICATION 审中-公开
    用于执行应用的方法和系统

    公开(公告)号:US20140188985A1

    公开(公告)日:2014-07-03

    申请号:US14140339

    申请日:2013-12-24

    Abstract: A method and a system for executing an application by interacting with a device and a plurality of external devices, and a computer-readable recording medium having recorded thereon a program for executing the method, are provided. The method includes receiving, by a host device, a selection signal for an application, displaying function information distributable by the application, mapping the function information to a plurality of devices, the mapping producing mapped information, and requesting the plurality of devices to perform functions according to the mapped information.

    Abstract translation: 提供了一种通过与设备和多个外部设备交互来执行应用的方法和系统,以及在其上记录有用于执行该方法的程序的计算机可读记录介质。 该方法包括:通过主机设备接收应用的选择信号,显示由应用分发的功能信息,将功能信息映射到多个设备,映射生成映射信息,以及请求多个设备执行功能 根据映射的信息。

    SEMICONDUCTOR CHIP AND FABRICATING METHOD THEREOF
    5.
    发明申请
    SEMICONDUCTOR CHIP AND FABRICATING METHOD THEREOF 有权
    半导体芯片及其制造方法

    公开(公告)号:US20130087891A1

    公开(公告)日:2013-04-11

    申请号:US13647785

    申请日:2012-10-09

    CPC classification number: H01L23/585 H01L22/34 H01L2924/0002 H01L2924/00

    Abstract: Disclosed is a method of fabricating a semiconductor chip. The method includes forming a silicon layer; forming a first layer formed on the silicon layer and including a first seal ring surrounding a first chip area and a second seal ring surrounding a second chip area; and forming a second layer formed on the first layer and including a metal interconnection connecting one of the first and second chip areas and an external terminal.

    Abstract translation: 公开了一种制造半导体芯片的方法。 该方法包括形成硅层; 形成在所述硅层上形成的第一层,并且包括围绕第一芯片区域的第一密封环和围绕第二芯片区域的第二密封环; 以及形成在所述第一层上形成的第二层,并且包括连接所述第一和第二芯片区域之一的金属互连件和外部端子。

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